2014
DOI: 10.1364/ao.53.005745
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Optimization of dry etching parameters for fabrication of polysilicon waveguides with smooth sidewall using a capacitively coupled plasma reactor

Abstract: In this paper, we demonstrate the optimization of a capacitively coupled plasma etching for the fabrication of a polysilicon waveguide with smooth sidewalls and low optical loss. A detailed experimental study on the influences of RF plasma power and chamber pressure on the roughness of the sidewalls of waveguides was conducted and waveguides were characterized using a scanning electron microscope. It was demonstrated that optimal combination of pressure (30 mTorr) and power (150 W) resulted in the smoothest si… Show more

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Cited by 17 publications
(4 citation statements)
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“…Yet for cells, the previously mentioned methods are not entirely sufficient unless the refractive index is known for each cell being studied. By analyzing transmission density functions from a statistical approach, it should be very simple to program such equations into computer software, allowing for more sophisticated and precise analysis of cells, biological objects, and many other complex microparticles whereas well-established fabrication methods can be used for future device fabrication …”
Section: Discussionmentioning
confidence: 99%
“…Yet for cells, the previously mentioned methods are not entirely sufficient unless the refractive index is known for each cell being studied. By analyzing transmission density functions from a statistical approach, it should be very simple to program such equations into computer software, allowing for more sophisticated and precise analysis of cells, biological objects, and many other complex microparticles whereas well-established fabrication methods can be used for future device fabrication …”
Section: Discussionmentioning
confidence: 99%
“…Selectivity is vital during the etching process, as it determines the rate at which the substance is etched. Selectivity varies in wet etching, mostly between the photosensor and the materials or substance [89,90]. Materials can be etched in some directions (horizontally or vertically) at different rates.…”
Section: Micromachining Methods For Microconstructionmentioning
confidence: 99%
“…2) [44,45]. Double-side polished silicon wafers purchased from Nova Electronic Materials (Texas) were used as the substrate (Fig.…”
Section: Fabrication Flowmentioning
confidence: 99%