Optimization of the process of pressing particleboards by means of modifying phenol-formaldehyde resin with amide polymers

Dukarska, Dorota; Łęcka, J.

doi:10.1007/s00107-005-0093-5

Cited by 6 publications

(6 citation statements)

References 14 publications

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“…Both dielectric barrier discharge plasma treatment and previous compression of the veneers can reduce the UF adhesive spread rate 28,29 . Moreover, studies conducted by Dukarska et al 10,30 revealed that the MUPF (melamine‐urea‐phenol‐formaldehyde) and PF (phenol‐formaldehyde) adhesive modification with fumed nano‐SiO 2 and synthetic silica can also lead to the reduction in the amount of applied resin.…”

Section: Introductionmentioning

confidence: 99%

The reduction of adhesive application in plywood manufacturing by using nanocellulose‐reinforced urea‐formaldehyde resin

Kawalerczyk

Dziurka

Mirski

et al. 2020

J of Applied Polymer Sci

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The aim of the study was to investigate the effect of nanocellulose (cellulose nanocrystals [NCC]) addition to urea‐formaldehyde (UF) resin on the properties of plywood and the possibility of reducing resin spread rate in plywood production. The studies have shown the increase in viscosity of experimental adhesive mixture in comparison with reference one. On the basis of the bonding quality results, it was concluded that the NCC‐reinforcement led to significant improvement in bonding quality of plywood. Moreover, values of bending strength (modulus of rupture) and modulus of elasticity also increased because of the cellulosic nanoparticles introduction. The positive effect of NCC addition on the properties of plywood allowed the reduction of resin spread rate by 50 g/m2 and maintaining equally good strength as reference panels. The modification with nanocellulose itself did not lead to a decrease of free formaldehyde content. However, allowing the reduction of adhesive application led to a slight decrease in the amount of emitted formaldehyde.

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Section: Introductionmentioning

confidence: 99%

The reduction of adhesive application in plywood manufacturing by using nanocellulose‐reinforced urea‐formaldehyde resin

Kawalerczyk

Dziurka

Mirski

et al. 2020

J of Applied Polymer Sci

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“…Moreover, from the aesthetic point of view, the dark colour of the adhesive joint is a drawback. So far, a number of research projects have been carried out aimed at increasing the reactivity of phenolic resins through proper selection of substrates, mole ratio of reagents and condensation conditions as well as through introducing modifiers into the resin, which are meant to accelerate the cross-linking process (Park et al 1999;Conner et al 2002;Dukarska and Łęcka 2006;Mirski et al 2008Mirski et al , 2011Zhang et al 2013). Phenolic resins, just like amine resins, join surfaces through adhesion.…”

Section: Introductionmentioning

confidence: 99%

Construction particleboards made from rapeseed straw glued with hybrid pMDI/PF resin

et al. 2016

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“…To evaluate the optimal curing temperatures, dynamic DSC experiments were performed on the selected commercial resins, both neat and in mixture with the specific catalysts. In the case of UF resin, 2.4 wt % of ammonium sulfate was added 41, 42. The amount of catalyst was calculated with respect to the dry resin content.…”

Section: Resultsmentioning

confidence: 99%

Low formaldehyde emission particleboard panels realized through a new acrylic binder

Amazio

Avella

Errico

et al. 2011

J of Applied Polymer Sci

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ABSTRACT:The effectiveness of acrylic resins as low formaldehyde emission binders for particleboard production was explored. In particular, a multifunctional methacrylic monomer, ethoxylated bisphenol A dimethacrylate, classified as nonskin and eyes irritant, was selected and tested. In comparison panels realized with classic ureaformaldehyde (UF) binder were also prepared. No significant differences were found through the morpholocigal analysis of samples prepared with the two different binders. Moreover, particleboard panels realized with the acrylic binder showed better mechanical properties and lower water absorption and thickness swelling in comparison with corresponding panels realized with the UF binders. Furthermore, the replacement of the UF with the acrylic binder did not affect thermal insulation properties of the panels. Formaldehyde release tests revealed that particleboard panels obtained by applying the acrylic binder can be classified as E1 following the European classification and even F**** following the stricter Japanese classification.

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Optimization of the process of pressing particleboards by means of modifying phenol-formaldehyde resin with amide polymers

Cited by 6 publications

References 14 publications

The reduction of adhesive application in plywood manufacturing by using nanocellulose‐reinforced urea‐formaldehyde resin

The reduction of adhesive application in plywood manufacturing by using nanocellulose‐reinforced urea‐formaldehyde resin

Construction particleboards made from rapeseed straw glued with hybrid pMDI/PF resin

Low formaldehyde emission particleboard panels realized through a new acrylic binder

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