“…[18][19][20][21] Although studies have shown that these ARB laminates also exhibit extraordinary thermal stability, the underlying mechanism that leads to their eventual breakdown under high temperatures (700 C) has yet to be unveiled. 6,13,22 In contrast to the PVD laminates, the ARB laminates contain single crystal layers with extremely highaspect-ratio grains (over 30) and hence a very low density of triple junctions. 7 Therefore, previously identified thermally induced mechanisms for layered structures, such as grain boundary migration (e.g., the zig-zag locking mechanism found in the PVD foils 15 ), bulk diffusion controlled crystalline defect migration, 23 and the common pinch off at triple junctions, 24 cannot dominate in the unique nanostructure of the ARB Cu-Nb composites.…”