2017 12th International Conference on Design &Amp; Technology of Integrated Systems in Nanoscale Era (DTIS) 2017
DOI: 10.1109/dtis.2017.7930176
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Oxide-based RRAM models for circuit designers: A comparative analysis

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Cited by 20 publications
(13 citation statements)
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“…V Cell is the voltage across the cell and I Cell the current through the cell. A good agreement with experimental data is obtained with a ±5% standard deviation on parameters α and Lx of the model, where Lx is the OxRAM oxide thickness and α is the transfer coefficients (ranging between 0 and 1) [22].…”
Section: Mlc Design Schemesupporting
confidence: 73%
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“…V Cell is the voltage across the cell and I Cell the current through the cell. A good agreement with experimental data is obtained with a ±5% standard deviation on parameters α and Lx of the model, where Lx is the OxRAM oxide thickness and α is the transfer coefficients (ranging between 0 and 1) [22].…”
Section: Mlc Design Schemesupporting
confidence: 73%
“…In addition to the large HRS window available for MLC, targeting the HRS, instead of the LRS domain, will result in a significant reduction in energy during the READ operations following the programming operations. For memory array simulations, a compact OxRAM model [21,22] calibrated on measurements proposed in Section 2 is used. The model accurately reproduces the stochastic switching nature of OxRAM cells.…”
Section: Oxram Modelmentioning
confidence: 99%
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“…A single RRAM device (Figure 7) is simulated using each model. The transient I-V characteristics of the different simulated models using this configuration have been published in our previous work [30]; and the results are explained in Section V.…”
Section: B 1r Configurationmentioning
confidence: 99%
“…The OxRAM model used for simulations is a compact model calibrated on silicon well suited to simultaneously describe SET and RESET operations [27]. 4 Non-volatile SRAM…”
Section: T1r Oxram Cell Simulationmentioning
confidence: 99%