Oxygen redistribution in silicon during zone melting recrystallization

The oxygen content in zone melting recrystallization silicon-on-insulator (ZMR SOI) layers with thicknesses ranging between 0.5 and 25 μm obtained with a movable lampheater is studied. Secondary-ion-mass spectrometry profiling as well as numerical calculations are presented. The simulations are based on oxygen redistribution during cooling down. In the model it is assumed that the interface reaction is fast enough to be not the rate-limiting step in the redistribution process. Consequently, the oxygen transport was considered to be entirely diffusion limited. Good agreement was found between the measurements and calculated values. The profiles show a maximum at the center of the layer and symmetrically depleted regions in the top and bottom of the silicon film. It has been generally accepted that ZMR SOI layers have a high oxygen concentration corresponding to the saturation level at melting point. In the present study, however, we show that in the 0.5-μm layers the oxygen concentration is as low as 1×1017(O atoms)/cm3.

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Electrical transport and related properties of zone-melt-recrystallized silicon-on-insulator films

Thompson

Collins

Stein

1991

Journal of Applied Physics

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Electrical transport properties of zone-melt-recrystallized Si films of Si-on-Insulator wafers were investigated using resistivity and Hall effect measurements between 77 and 300 K. Both graphite strip and cold cathode electron beam methods were used for zone melting which produced high resistivity (≳103 Ω cm at room temperature) recrystallized films. Phosphorus implantation into the silicon films to a dopant level of 1×1016 cm−3 and subsequent annealing at 1100 °C reduced the room-temperature resistivities to ∼1 Ω cm. Hall mobilities of 950 cm2/V s were observed at room temperature for both materials after the implant anneal sequence. However, for temperatures less than 150 K, the mobility is higher in graphite strip than in electron beam recrystallized films. This behavior is consistent with the relative crystalline qualities of the two films as determined by electron channeling and x-ray diffraction. It is noteworthy that a deep level was observed at 0.2 eV below the conduction band in the graphite strip recrystallized film but not in the electron beam recrystallized samples.

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Oxygen redistribution in silicon during zone melting recrystallization

Cited by 4 publications

References 3 publications

Recent applications of compositional depth profiling by secondary ion mass spectrometry

Recent applications of compositional depth profiling by secondary ion mass spectrometry

Oxygen distribution in silicon-on-insulator layers obtained by zone melting recrystallization

Electrical transport and related properties of zone-melt-recrystallized silicon-on-insulator films

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