P‐44: Electromagnetic Interference (EMI) Suppression in an Intra‐Panel Interface with Periodic Clock‐Embedded Signaling Scheme

Abstract

An intra-panel interface system employing data scrambling for EMI suppression is presented in this work. The proposed data scrambler targets two sources of EMI found in a periodic clockembedded interface system: active data field and horizontal blanking period (HBP). For verification, an intra-panel interface based on enhanced Reduced Voltage Differential Signaling (eRVDS) with data scrambling function is implemented in CMOS technology, and EMI measurement of the prototype shows that suppression of data-induced EMI can be successfully achieved by the proposed scrambling technique.

22.4: Invited Paper: A 1.8‐Gbps Intra‐Panel Interface with Power Reduction and EMI Suppression Schemes for Tablet PC Applications

“…The eRVDS interface adopts a point-to-point topology between TCON and multiple S-ICs which are connected via a channel consisting of printed circuit board (PCB), flexible printed circuit (FPC), and glass [3]. This interface channel, in most tablet PC applications, exceeds the critical length of λ/20 and behaves as an effective EMI antenna for high-speed data signals [1]. This work, therefore, proposes STMC which is targeted at minimizing toggle ratio of high-speed display data which can consequently reduce both dynamic power and EMI radiation in the eRVDS intra-panel interface.…”

“…Moreover, the intra-panel interface is mandated to have both low power and low level of EMI to refrain from desensitizing the neighboring RF transceivers supporting Wi-Fi, GPS, 3G, 4G, and/or other numerous mobile communication standards. Unfortunately, the increased data rate coupled with long transmission channel (i.e., composed of PCB, FPC, and glass panel) length has made the intra-panel interface the main source of EMI in display systems [1]. To resolve the EMI radiation issue, previous works have adopted a conventional method of scrambling the high-speed display data to eliminate any periodicity that can induce energy spikes at harmonic frequencies of repetition [1][2].…”

“…Unfortunately, the increased data rate coupled with long transmission channel (i.e., composed of PCB, FPC, and glass panel) length has made the intra-panel interface the main source of EMI in display systems [1]. To resolve the EMI radiation issue, previous works have adopted a conventional method of scrambling the high-speed display data to eliminate any periodicity that can induce energy spikes at harmonic frequencies of repetition [1][2]. The scrambling function, however, can increase the dynamic current of the interface system because data randomization can simultaneously increase the data toggle ratio.…”

22.2: WITHDRAWN: 22.3: Invited Paper: Intra‐Panel Interface Technology for High‐Resolution Tablet PC Applications

“…On the other hand, eDP interface is also often adopted due to higher data rate and fewer number of high speed signal lines for a multichip solution of a timing controller and column drivers which offers advantages like large display panel size and narrow bezel width. To distribute image data from the timing controller to column drivers at high data rate, several dedicated intra-panel interfaces for Chip-On-Glass (COG) technology such as Low Current Differential Signaling (LCDS) [1], Reduced Voltage Differential Signaling (RVDS) [2], and enhanced Reduced Voltage Differential Signaling (eRVDS) [3][4][5][6] have been developed. These intra-panel interfaces also require low power and low electromagnetic interference (EMI) or RFI noise radiation performance for long battery lifetime and to guarantee RF connectivity, respectively.…”