Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages

Hong, Tan Hua; Beleran, John D.; Drake, Ken; Wilson, Ong Pl; Mehta, Gaurav; Librado, G.; Zhang, X. R.; Surasit, C.

doi:10.1109/tcpmt.2011.2158106

Cited by 5 publications

(1 citation statement)

References 2 publications

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“…Flip-chip and wire bonding are widely adopted techniques to interconnect chip and PCB board [15]. In flip-chip method, small solder bumps are employed in PCB board.…”

Section: B Wire Bondng Interconnectsmentioning

confidence: 99%

High-Power Wire Bonded GaN Rectifier for Wireless Power Transmission

et al. 2020

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A novel wire bonded GaN rectifier for high-power wireless power transfer (WPT) applications is proposed. The low breakdown voltage in silicon Schottky diodes limits the high-power operations of microwave rectifier. The proposed microwave rectifier consists of a high breakdown voltage GaN rectifying element for high-power operation and a novel low loss impedance matching technique for high efficiency performance. Wire bonding method is adopted to provide electrical connection between GaN chip and board which induces undesirable inductance. In order to realize high efficiency performance, an impedance matching network is proposed to exploit the unavoidable inductance along with a single shunt capacitor, resulting in a low loss matching circuit to achieve a compact high-power rectifier. The fabricated GaN rectifier exhibits a good performance in the high-power region and can withstand up to 39 dBm input power before reaching the breakdown limit at the operating frequency of 0.915 GHz and load resistance of 100. It has a compact size and exhibits high efficiency performance in high-power region (achieved a maximum efficiency of 61.2% at 39 dBm), making it suitable for high-power applications like future unmanned intelligent devices and WPT in space applications. INDEX TERMS GaN, high-power rectifier, microwave rectifier, rectenna, wire bonding, wireless power transfer (WPT).

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“…Flip-chip and wire bonding are widely adopted techniques to interconnect chip and PCB board [15]. In flip-chip method, small solder bumps are employed in PCB board.…”

Section: B Wire Bondng Interconnectsmentioning

confidence: 99%