Youth leadership development is one of the important agenda needed in the country's development agenda as outlined in the Malaysian Youth Policy 2015. The involvement of young leaders can be strengthened through wider exposure and professional training that enhances Positive Youth Development among youths. Thus, in community context, the role of police leadership is not merely just as law enforcement officer but an icon of leadership. The authority in public order and security granted by the law to the police officer can be a positive exertion to influence the youth and it has the potential in providing that kind of learning process. Therefore, this paper will explore the process of youth development towards PYD and how police leadership enhanced youth to become leader in the community. The discussion addressed in this paper is how police leadership contributes to the process of developing youth leadership ability form at risk behavior and eventually fulfilling the overall PYD needs.

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The increasing demand for high performance integrated circuit devices has led to the development of multi-die stacking in a single package to improve functionality without increasing package form factor. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking. Stacking same-sized dies directly on top of each other provides a unique challenge since there can be no clearance for the lower die bond wires. The solutions include (1) dummy silicon-as-spacer, (2) die attach paste-as-spacer and (3) die attach film-as spacer. Key requirements for the die attach (DA) paste or film is excellent adhesion to the passivation materials of adjacent dies. Also, a uniform bond-line thickness (BLT) is required for a large die application. In addition, high cohesive strength at high temperatures and low moisture absorption are preferred for good reliability. This paper focuses on the key DA materials challenges and resolution associated with the same-sized dies stacked packages qualification. The DA materials assessment includes both paste and film-based adhesive. Packages were built to understand how these DA adhesives would work inpackage and study its reaction to the assembly process conditions.

As the progression of 45/40nm ELK devices into mainstream semiconductor assembly manufacturing process increases, the drive to achieve adoption without major changes to process and equipment infrastructure while meeting the superior yield necessary is high. The main goal of this article is to share learning's and provide solutions for integration of 45/40nm ELK devices into Flip Chip and Wire Bond interconnect technology. The scope of this paper covers from FBGA/PBGA for the WB packages and fcCSP for the Flip Chip Devices.The main challenge and focus point for wire bond 45/40nm interconnects is on the 1 st bond process. This paper will share some detailed analysis on the following: WB characterization for 45/40nm ELK ultra-finepitch  Key factors for good ball bond integrity and comparison of Au and Cu wire bond process  Recommendations for achieving the required levels of reliability for 45nm Cu ELK integration. The challenges however, for Flip Chip technology are significantly different from the WB process. More and more adoption is being made from conventional eutectic solder bumps or high-lead solder bumps towards the lead-free solder bumps mainly due to the green initiatives. This paper will share analysis on the following: Thermo-Mechanical Simulation on key input factors and its correlation to actual evaluation results.  Integration of Pb Free ELK Bump with 40nm ELK technology with focus on the critical reflow process.