Copper-based shape memory alloy (SMA) was obtained through a classic melting
method. The material was analyzed in heat treated and deformed states using
scanning electrons microscopy (SEM), dilatometry (DIL), differential
scanning calorimetry (DSC), dynamic mechanical analyzer (DMA) and energy
dispersive X-ray analyze (EDAX) to establish the material microstructure,
memory properties like martensitic transformation domain and rate or damping
capacity. The material exhibits a good shape memory effect and high internal
friction and it is proposed as target in a pulsed laser deposition (PLD)
process for obtaining thin films. The deposition process is described in
this paper through presented experimental results on the layer.