2013
DOI: 10.1117/12.2033258
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Patterning of EUVL binary etched multilayer mask

Abstract: Recently, development of next generation extremely ultraviolet lithography (EUVL) equipment with high-NA (Numerical Aperture) optics for less than hp10nm node is accelerated. While studying more than 0.45 NA, incident angle distribution of EUV light irradiation to mask becomes larger. It induces degradation of exposure margin to form horizontal line pattern (perpendicular to EUV light direction) because of large mask 3D effect. In order to resolve this issue, we evaluate binary etched multilayer mask structure… Show more

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Cited by 5 publications
(1 citation statement)
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“…1(c). [3][4][5][6] Moreover, Kim et al also confirmed this observation by numerical analysis. 7,8 However, the mask structure should be taken into account when dealing with the mask fabrication processes, such as patterned mask inspection, 9-13 critical dimension measurement (CD metrology), 14,15 mask repair, 16,17 and cleaning.…”
Section: Introductionsupporting
confidence: 72%
“…1(c). [3][4][5][6] Moreover, Kim et al also confirmed this observation by numerical analysis. 7,8 However, the mask structure should be taken into account when dealing with the mask fabrication processes, such as patterned mask inspection, 9-13 critical dimension measurement (CD metrology), 14,15 mask repair, 16,17 and cleaning.…”
Section: Introductionsupporting
confidence: 72%