2004
DOI: 10.1109/jlt.2004.833533
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PCB-Compatible Optical Interconnection Using 45<tex>$^circ$</tex>-Ended Connection Rods and Via-Holed Waveguides

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Cited by 70 publications
(18 citation statements)
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“…Since optical interconnects are promising to overcome these bottlenecks [65,66], comprehensive accomplishments to implement optics into computers have been done [67][68][69][70][71][72][73][74]. Figure 8.41 shows a concept of the 3D integrated optical interconnects within computers, which we expect to be the final goal of optical interconnects [12,52,[75][76][77][78].…”
Section: Three-dimensional Integrated Optical Interconnects Within Comentioning
confidence: 99%
“…Since optical interconnects are promising to overcome these bottlenecks [65,66], comprehensive accomplishments to implement optics into computers have been done [67][68][69][70][71][72][73][74]. Figure 8.41 shows a concept of the 3D integrated optical interconnects within computers, which we expect to be the final goal of optical interconnects [12,52,[75][76][77][78].…”
Section: Three-dimensional Integrated Optical Interconnects Within Comentioning
confidence: 99%
“…To alleviate this problem, optical interconnects on PCB have been studied as a promising solution due to their advantages such as higher bandwidth, lower power consumption in long distance, EMI free, reduction of impedance matching problem, larger pin density, etc. It has the potential to outperform electrical interconnects and to solve the bottleneck in high-performance integrated circuits ultimately [1][2].…”
Section: Introductionmentioning
confidence: 99%
“…The interconnect scheme for chip-to-chip optical link on an optical PCB consists of photodiodes (PDs) and front-end amplifiers in a receiver (Rx) module, vertical-cavity surface emitting lasers (VCSELs) and driver ICs in a transmitter (Tx) module [1][2][3]. To send and receive data via the optical link between LSI chips (e.g., CPU and memory), both multiplexed input and output signals in time division should be transmitted bidirectionally through one input/output (I/O) pin.…”
Section: Introductionmentioning
confidence: 99%
“…This butt-coupling scheme eliminates the need for intermediary deflection optics on the backplane e.g. 45° micro-mirrors [2] [5], and thus the additional cost and complexity of additional fabrication steps with precision assembly and alignment. …”
Section: Introductionmentioning
confidence: 99%