2021
DOI: 10.1109/tpel.2020.3047466
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Performance of GaN Power Devices for Cryogenic Applications Down to 4.2 K

Abstract: Gallium nitride (GaN) power devices are employed in an increasing number of applications thanks to their excellent performance. Nevertheless, their potential for cryogenic applications, such as space, aviation, and superconducting systems, has not yet been fully explored. In particular, little is known on the device performance below liquid nitrogen temperature (77 K) and the behavior of popular GaN architectures such as Gate Injection Transistor (GIT) and Cascode below room temperature has not yet been report… Show more

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Cited by 61 publications
(25 citation statements)
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“…8(a). As evident from that figure, GaN HEMTs do not show any carrier freeze-out effect at cryogenic temperatures [9]. This is because the channel carrier originates from piezoelectric effect and not from intentional doping which involves no ionization energy requirement.…”
Section: Resultsmentioning
confidence: 68%
“…8(a). As evident from that figure, GaN HEMTs do not show any carrier freeze-out effect at cryogenic temperatures [9]. This is because the channel carrier originates from piezoelectric effect and not from intentional doping which involves no ionization energy requirement.…”
Section: Resultsmentioning
confidence: 68%
“…At switching frequencies of 140 kHz, a cryogenic 40-kW three-level NPC inverter showed 30 percent less losses than at room temperature [24]. Moreover, the operation of Gallium Nitride (GaN) power devices has been demonstrated over a temperature range from 400 K and down to 4.2 K, allowing high operational flexibility [25]. GaN devices have also been shown to have an overload current capability of four times the rated capacity when cryogenically cooled [26].…”
Section: Cold and Cryogenic Power Electronics (Cpe)mentioning
confidence: 99%
“…At switching frequencies of 140 kHz, a cryogenic 40-kW three-level NPC inverter showed 30 percent less losses than at room temperature [21]. Moreover, the operation of Gallium Nitride (GaN) power devices has been demonstrated over a temperature range from 400 K and down to 4.2 K, allowing high operational flexibility [22]. GaN devices have also been shown to have an overload current capability of four times the rated capacity when cryogenically cooled [23].…”
Section: Cold and Cryogenic Power Electronics (Cpe)mentioning
confidence: 99%