2007
DOI: 10.1364/ao.46.000379
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Phase error corrected 4-bit true time delay module using a cascaded 2 × 2 polymer waveguide switch array

Abstract: A fully integrated 4-bit true time delay device using polymer optical switches and waveguide delay lines is demonstrated. The fabricated device, which contains five 2x2 thermo-optic switches, has a maximum power consumption of 143 mW and a switching time less than 3 ms. The rf phase error, which is affected by the optical switch cross talk, is also theoretically analyzed and proved to be negligible by experimental results.

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Cited by 29 publications
(8 citation statements)
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“…The switches and the delay waveguides together form a 4 bit RTTDL. The maximum power consumption is 143 mW, and the switching time is less than 3 ms [101,102] . A silica waveguide platform was also quite suitable for reconfigurable true delay lines for optical beam forming applications.…”
Section: Multi-path Switchable Delay Linesmentioning
confidence: 99%
“…The switches and the delay waveguides together form a 4 bit RTTDL. The maximum power consumption is 143 mW, and the switching time is less than 3 ms [101,102] . A silica waveguide platform was also quite suitable for reconfigurable true delay lines for optical beam forming applications.…”
Section: Multi-path Switchable Delay Linesmentioning
confidence: 99%
“…The most direct and easiest approach for tunable group delay is changing the optical physical distance [9]. For instance, typical schemes are dependent on the selection of long or short delay paths in each stage by Mach-Zehnder interferometer switches [10][11][12]. Recently, a novel scheme of hexagonal integrated waveguide mesh configurations was proposed for the implementation of compact discrete and continuous optical true-time delay lines [13].…”
Section: Introductionmentioning
confidence: 99%
“…Polymer-based passive and active photonic devices have been extensively used in various applications, including communication networks [1][2][3][4][5][6][7][8][9][10][11][12], optical backplanes and interchip interconnects [13][14][15][16][17][18][19][20][21], sensors [22][23][24][25][26][27][28][29][30][31][32], etc. Low-cost and high-efficiency packaging of these devices is crucial in order to enable an economically viable market.…”
Section: Introductionmentioning
confidence: 99%