Phase selection and nano-mechanical properties of intermetallic compounds in directionally solidified Cu-68at.%Sn peritectic alloy

Zhang, Anqiao; Peng, Peng; Zheng, Wenjuan; Yang, Jieren; Zhang, Xudong; Xu, Yuanli

doi:10.1016/j.jallcom.2020.157866

Cited by 10 publications

(3 citation statements)

References 45 publications

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“…At present, the only alternatives are computer simulations. In terms of experiments: the hardness, Young’s moduli, and creep properties of IMCs have been studied by nano-indentation methods at different temperatures and loading rates [ 4 , 5 , 6 , 7 , 8 , 9 ]. In nano-indentation experiments, special samples need to be prepared, and due to the limited thickness of IMCs, it is difficult to obtain pure samples.…”

Section: Introductionmentioning

confidence: 99%

Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation

et al. 2022

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Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of electronics. Cu6Sn5 is one of the main components of IMCs, and its mechanical properties considerably influence the reliability of solder joints. In this study, the effects of grain size (8–20 nm) on the mechanical properties (Young’s modulus, yield stress, ultimate tensile strength (UTS), and strain rate sensitivity) of polycrystalline Cu6Sn5 were investigated using molecular dynamics simulations at 300 K and at a strain rate of 0.0001–10 ps−1. The results showed that at high strain rates, grain size only slightly influenced the mechanical properties. However, at low strain rates, Young’s modulus, yield stress, and UTS all increased with increasing grain size, which is the trend of an inverse Hall–Petch curve. This is largely attributed to the sliding and rotation of grain boundaries during the nanoscale stretching process, which weakens the interaction between grains. Strain rate sensitivity increased with a decrease in grain size.

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Section: Introductionmentioning

confidence: 99%

Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation

et al. 2022

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“…Most solidification behaviors take place outside of the equilibrium state because of the rapid cooling rate or the large undercooling (∆T), which result in various microstructures and properties [2,3]. So far, the microstructural evolution and phase selection behaviors of undercooled melts have been investigated in many systems, such as the Mn-Si [4] and Cu-Sn [5] systems, using cyclic overheating combined with glass fluxing [6], directional solidification [5], and laser melting [7], with in situ observations [8] or numerical simulations [9], to manipulate and control the microstructures and properties. For instance, the uniform nature and refinement of the grains can be obtained as the ∆T increases, which can effectively improve the yield strength [10] and the physical properties [11].…”

Section: Introductionmentioning

confidence: 99%

Re-Examination of the Microstructural Evolution in Undercooled Co-18.5at.%B Eutectic Alloy

et al. 2022

Materials

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The undercooling (∆T) dependencies of the solidification pathways, microstructural evolution, and recalescence behaviors of undercooled Co-18.5at.%B eutectic alloys were systematically explored. Up to four possible solidification pathways were identified: (1) A lamellar eutectic structure consisting of the FCC–Co and Co3B phase forms, with extremely low ΔT; (2) The FCC–Co phase primarily forms, followed by the eutectic growth of the FCC–Co and Co2B phases when ΔT < 100 K; (3) As the ΔT increases further, the FCC–Co phase primarily forms, followed by the metastable Co23B6 phase with the trace of an FCC–Co and Co23B6 eutectic; (4) When the ΔT increases to 277 K, the FCC–Co phase primarily forms, followed by an FCC–Co and Co3B eutectic, which is similar in composition to the microstructure formed with low ΔT. The mechanisms of the microstructural evolution and the phase selection are interpreted on the basis of the composition segregation, the skewed coupled zone, the strain-induced transformation, and the solute trapping. Moreover, the prenucleation of the primary FCC–Co phase was also detected from an analysis of the different recalescence behaviors. The present work not only enriches our knowledge about the phase selection behavior in the undercooled Co–B system, but also provides us with guidance for controlling the microstructures and properties practically.

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“…Domestic and foreign research both present studies on the mechanical properties of Cu 6 Sn 5 and Cu 3 Sn. The Young's modulus (E) and hardness (H) of Cu 3 Sn and Cu 6 Sn 5 were measured by nanoindentation experiments [10][11][12][13]. Ghosh et al [14] identified the values of E, shear modulus (G), bulk modulus (B), and Poisson's ratio (ν) using the pulse-echo method.…”

Section: Introductionmentioning

confidence: 99%

The Mechanical Properties and Elastic Anisotropy of η′-Cu6Sn5 and Cu3Sn Intermetallic Compounds

et al. 2021

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Full intermetallic compound (IMC) solder joints present fascinating advantages in high-temperature applications. In this study, the mechanical properties and elastic anisotropy of η’-Cu6Sn5 and Cu3Sn intermetallic compounds were investigated using first-principles calculations. The values of single-crystal elastic constants, the elastic (E), shear (G), and bulk (B) moduli, and Poisson’s ratio (ν) were identified. In addition, the two values of G/B and ν indicated that the two IMCs were ductile materials. The elastic anisotropy of η’-Cu6Sn5 was found to be higher than Cu3Sn by calculating the universal anisotropic index. Furthermore, an interesting discovery was that the above two types of monocrystalline IMC exhibited mechanical anisotropic behavior. Specifically, the anisotropic degree of E and B complied with the following relationship: η’-Cu6Sn5 > Cu3Sn; however, the relationship was Cu3Sn > η’-Cu6Sn5 for the G. It is noted that the anisotropic degree of E and G was similar for the two IMCs. In addition, the anisotropy of the B was higher than the G and E, respectively, for η’-Cu6Sn5; however, in the case of Cu3Sn, the anisotropic degree of B, G, and E was similar.

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Phase selection and nano-mechanical properties of intermetallic compounds in directionally solidified Cu-68at.%Sn peritectic alloy

Cited by 10 publications

References 45 publications

Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation

Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation

Re-Examination of the Microstructural Evolution in Undercooled Co-18.5at.%B Eutectic Alloy

The Mechanical Properties and Elastic Anisotropy of η′-Cu6Sn5 and Cu3Sn Intermetallic Compounds

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