Phone‐nomenon 2.0: A compact thermal model for smartphones

Abstract

This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a compact thermal model for these non‐linearities have been studied and proposed. Then, an iterative simulation procedure to handle these non‐linearities was developed, and the basic simulation framework which is one option in Phone‐nomenon 2.0 was established and we call it Phone‐nomenon.Iter. Finally, the linearisation approach was applied, and model order reduction techniques to enhance and speed up the basic framework were employed, and these two options Phone‐nomenon.Lin and Phone‐nomenon.LinMOR were named. Compared with a commercial tool, ANSYS Icepak, Phone‐nomenon.Iter can achieve two orders of magnitude speedup with the maximum error being less than 1.90% for steady‐state simulations and three orders of magnitude speedup with the temperature difference being less than 0.65°C for transient simulations. In addition, the speedup of Phone‐nomenon.Lin over Phone‐nomenon.Iter can be at least 4.22× and 3.26× for steady‐state and transient simulations, respectively. Moreover, the speedup of Phone‐nomenon.LinMOR over Phone‐nomenon.Lin is at least 2.57×.