2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 2017
DOI: 10.1109/eptc.2017.8277477
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Photo-dielectric polymer material characterization to improve reliability of 3D-IC packaging

Nacima Alloutil
1
,
Anaïs De Lehelle D'Affroux
2
,
P. Chausse
3
et al.
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