2013
DOI: 10.1016/j.powtec.2013.02.024
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Photo-initiated chemical vapor deposition as a scalable particle functionalization technology (a practical review)

Abstract: Document publié chez l'éditeur officiel

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Cited by 42 publications
(19 citation statements)
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References 63 publications
(98 reference statements)
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“…While this shortcoming can be curtailed in part when using magnetic nanoparticles, it is generally dodged in the literature for other types of nanomaterials 8 , 12 , 28 . Plasma and thermal deposition processes have also important drawbacks, such as high energy consumption, limited scale-up potential (owing to reactor design and low pressure requirements) and compatibility with heat-sensitive substrates 37 – 39 . In most cases, quantities of coated nanoparticles are limited to micro- or milligrams.…”
Section: Introductionmentioning
confidence: 99%
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“…While this shortcoming can be curtailed in part when using magnetic nanoparticles, it is generally dodged in the literature for other types of nanomaterials 8 , 12 , 28 . Plasma and thermal deposition processes have also important drawbacks, such as high energy consumption, limited scale-up potential (owing to reactor design and low pressure requirements) and compatibility with heat-sensitive substrates 37 – 39 . In most cases, quantities of coated nanoparticles are limited to micro- or milligrams.…”
Section: Introductionmentioning
confidence: 99%
“…Photo-initiated chemical vapor deposition (PICVD) is well-suited to address this need, as it is a gentle process capable of operating at room temperature and pressure, has a relatively simple reactor design, is capable of using simple precursors (e.g. syngas), consumes low amounts of energy and provides good control over the thin film deposition process 39 42 .…”
Section: Introductionmentioning
confidence: 99%
“…News groups are chemically bonded to the surface, which should prevent leaching. Available technologies included sol-gel 15 23 and chemical vapour deposition (CVD) 24 . By opting for a gas-phase approach like CVD, it is possible to further prevent residual solvent leaching.…”
mentioning
confidence: 99%
“…Heat initiation is problematic with temperature-sensitive substrates such as polymers 25 34 , whereas plasma is plagued with scale-up issues due to specific operating requirements 12 25 35 36 37 . PICVD is an alternative with its low energy treatment and wide spectrum of possible variations 24 35 . Indeed, depending on the light source used, it can be operated at ambient temperature and pressure conditions, without the use of highly specialized equipment.…”
mentioning
confidence: 99%
“…With this in mind, the present study focuses on the surface functionalization of wood performed with an alternative gas-phase method, photo-initiated CVD (PICVD). This low-cost process can be applied to several types of substrate and is flexible enough to be easily implemented in projects of larger scope, without the mechanical limitations imposed by heat treatments (Dorval Dion and Tavares 2013). Moreover, PICVD has demonstrated the ability to form a thin film with tuneable wettability on a wide variety of substrates, a potential indicator of desirable barrier properties (Dorval Dion et al 2014), (Farhanian et al 2014), (Bérard et al 2016), (Labonté et al 2016), (Farhanian et al 2017).…”
Section: Introductionmentioning
confidence: 99%