Photonic sintering process of ink-jet printed conductive microstructures

Fałat, Tomasz; Płatek, Bartosz; Felba, Jan; Mościcki, Andrzej; Smolarek, Anita; Stojek, Krzysztof

doi:10.1109/estc.2012.6542192

Cited by 3 publications

(1 citation statement)

References 5 publications

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“…-local heating; energy is absorbed only by printed structure when it is heated by laser beam [10,11], by pulsed light [12], or by UV light [13], -delivering microwave energy [14], -electrical excitation [15], -chemical reaction in low temperature [16].…”

Section: J Felba T Fałat and A Mościckimentioning

confidence: 99%

Nano sized silver for electronic packaging

Felba

Fałat

Mościcki³

2013

2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013)

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Production of modern microelectronic devices needs advanced materials and packaging technologies oriented towards the miniaturization and high reliability of the systems. Nano sized silver can be treated as such advanced material and it is used in modern packaging technologies, especially for flexible electronics. The paper presents information about the practical use of silver particles with the size from 4 nanometers in materials for electronic packaging technologies.The special ink containing nanosilver is use for ink-jet printing electrically conductive structures. Such process can be applied for flexible electronics even when structures are printed on temperature sensitive materials. Ink-jet printing may be used for creating the conductive layers of microvias joining both sides of flexible substrates with acceptable level of resistance. Nano sized silver is also used as a component of hybrid filler for electrically and thermally conductive polymer based composites, although the role of nanosilver particles in transport of current or heat in such materials is limited. Nanosilver plays an increasingly important role in joints elements working at high temperatures. The sintering process is done at temperatures significantly below 300 °C and the highest shear strength of joined elements reached several dozens of MPa.J. Felba is with the Faculty

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Section: J Felba T Fałat and A Mościckimentioning

confidence: 99%

Nano sized silver for electronic packaging

Felba

Fałat

Mościcki³

2013

2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013)

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Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging

Felba

2018

Nanopackaging

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Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications

Trotter

Juric

Bagherian

et al. 2020

Sensors

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Inkjet technology as a maskless, direct-writing technology offers the potential for structured deposition of functional materials for the realization of electrodes for, e.g., sensing applications. In this work, electrodes were realized by inkjet-printing of commercial nanoparticle gold ink on planar substrates and, for the first time, onto the 2.5D surfaces of a 0.5 mm-deep microfluidic chamber produced in cyclic olefin copolymer (COC). The challenges of a poor wetting behavior and a low process temperature of the COC used were solved by a pretreatment with oxygen plasma and the combination of thermal (130 • C for 1 h) and photonic (955 mJ/cm 2 ) steps for sintering. By performing the photonic curing, the resistance could be reduced by about 50% to 22.7 µΩ cm. The printed gold structures were mechanically stable (optimal cross-cut value) and porous (roughness factors between 8.6 and 24.4 for 3 and 9 inkjet-printed layers, respectively). Thiolated DNA probes were immobilized throughout the porous structure without the necessity of a surface activation step. Hybridization of labeled DNA probes resulted in specific signals comparable to signals on commercial screen-printed electrodes and could be reproduced after regeneration. The process described may facilitate the integration of electrodes in 2.5D lab-on-a-chip systems.

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Photonic sintering process of ink-jet printed conductive microstructures

Cited by 3 publications

References 5 publications

Nano sized silver for electronic packaging

Nano sized silver for electronic packaging

Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging

Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications

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