Amorphous oxide semiconductor
(AOS) field-effect phototransistors
(FEPTs) are promising candidates for emerging photodetectors. Unfortunately,
traditional lateral AOS FEPTs suffer from low photosensitivity, slow
response time and inadequate mechanical flexibility, which restrict
their widespread commercial application. In this work, novel AOS-based
vertical field-effect phototransistor (VFEPT) arrays are presented,
where the semiconducting layer and source and drain electrodes are
deposited by inkjet printing. Benefitted from the unique vertical
structure and ultrashort channel length, the exciton dissociation,
carrier transfer, and collection efficiency were dramatically enhanced,
resulting in excellent photoelectric performance in VFEPT devices,
which was better than that of the traditional lateral AOS phototransistors.
Moreover, flexible AOS VFEPT arrays were investigated for the first
time on polyimide substrates. Due to the unique vertical architecture,
the carrier transport was negligibly affected by the strain-induced
in-plane cracks of the semiconductor channel layer during the mechanical
bending process, which overcame the maximum bending limit of traditional
lateral AOS thin-film transistors to ensure a transistor technique
that gives notable mechanical robustness against repeated mechanical
bending. Hence, this work provided a new pathway in emerging applications
for AOS photodetectors with sensitivity, transparency, and flexibility.