Oxide semiconductor devices play a role in both switches and photo-sensors in interactive displays. During the fabrication of oxide semiconductor devices, the sol-gel solution process that is used to form an oxide semiconductor has various merits, including its simplicity and low cost as well as its good composition controllability. Here, we present the photosensitivity characteristics of an oxide photo thin-film transistor (TFT) created using the InZnO (IZO) sol-gel process. Upon exposure to light, photocurrent (Iphoto) in the negative gate bias regime is significantly increased with a negligible threshold voltage shift. The photosensitivity is modulated by geometrical factors and by the IZO material composition. We observed a significant effect of the channel thickness and IZO composition on the photosensitivity, which was attributed to the screening effect of optically ionized oxygen vacancies (Vo++). In particular, the optimized bi-layered oxide photo-TFT presents a good Iphoto/Idark photosensitivity value of 3 × 104 and a subthreshold slope of 0.96 V/decade. In addition, the persistent photoconductivity of the oxide photo-TFT was removed by applying positive gate voltage, resulting in good high-speed operation. These results taken together demonstrate that the IZO photo-TFT produced by the sol-gel process can be workable when applied to interactive displays.

The authors investigated the photoresponse of a double-layer oxide semiconductor (GaInZnO–InZnO) thin-film transistor (TFT) under illumination, where the photocurrent in the negative gate bias region increased significantly without a negative shift in the threshold voltage. In particular, in the forward gate bias sweep direction (from −VG to +VG), the hysteresis of the transfer curves of the photosensor TFT became pronounced when the negative gate bias and its duration were increased. Additionally, the photocurrent level of the TFT remained almost the same as the level measured using a DC reverse gate bias sweep mode (from +VG to −VG). An analysis of the transfer curves, capacitance–voltage curves, and energy band diagrams indicates that the hysteresis characteristics can be explained by the competing effects of electrical-stress-induced defect generation and the screening of the negative gate bias by doubly positively charged oxygen vacancies depending on the gate bias polarity. In particular, the origin of the photoresponse of the photosensor TFT under illumination was studied intensively by qualitative analysis.

A model that universally describes the characteristics of photocurrent in molybdenum disulphide (MoS2) thin-film transistor (TFT) photosensors in both ‘light on’ and ‘light off’ conditions is presented for the first time. We considered possible material-property dependent carrier generation and recombination mechanisms in layered MoS2 channels with different numbers of layers. We propose that the recombination rates that are mainly composed of direct band-to-band recombination and interface trap-involved recombination change on changing the light condition and the number of layers. By comparing the experimental results, it is shown that the model performs well in describing the photocurrent behaviors of MoS2 TFT photosensors, including the photocurrent generation under illumination and a hugely long time persistent trend of the photocurrent decay in the dark condition, for a range of MoS2 layer numbers.

In recent years, MoS2 has emerged as a prime material for photodetector as well as phototransistor applications. Usually, the higher density of state and relatively narrow bandgap of multi-layer MoS2 give it an edge over monolayer MoS2 for phototransistor applications. However, MoS2 demonstrates thickness-dependent energy bandgap properties, with multi-layer MoS2 having indirect bandgap characteristics and therefore possess inferior optical properties. Herein, we investigate the electrical as well as optical properties of single-layer and multi-layer MoS2-based phototransistors and demonstrate improved optical properties of multi-layer MoS2 phototransistor through the use of see-through metal electrode instead of the traditional global bottom gate or patterned local bottom gate structures. The see-through metal electrode utilized in this study shows transmittance of more than 70% under 532 nm visible light, thereby allowing the incident light to reach the entire active area below the source and drain electrodes. The effect of contact electrodes on the MoS2 phototransistors was investigated further by comparing the proposed electrode with conventional opaque electrodes and transparent IZO electrodes. A position-dependent photocurrent measurement was also carried out by locally illuminating the MoS2 channel at different positions in order to gain better insight into the behavior of the photocurrent mechanism of the multi-layer MoS2 phototransistor with the transparent metal. It was observed that more electrons are injected from the source when the beam is placed on the source side due to the reduced barrier height, giving rise to a significant enhancement of the photocurrent.

The threshold voltage instabilities and huge hysteresis of MoS thin film transistors (TFTs) have raised concerns about their practical applicability in next-generation switching devices. These behaviors are associated with charge trapping, which stems from tunneling to the adjacent trap site, interfacial redox reaction and interface and/or bulk trap states. In this report, we present quantitative analysis on the electron charge trapping mechanism of MoS TFT by fast pulse I-V method and the space charge limited current (SCLC) measurement. By adopting the fast pulse I-V method, we were able to obtain effective mobility. In addition, the origin of the trap states was identified by disassembling the sub-gap states into interface trap and bulk trap states by simple extraction analysis. These measurement methods and analyses enable not only quantitative extraction of various traps but also an understanding of the charge transport mechanism in MoS TFTs. The fast I-V data and SCLC data obtained under various measurement temperatures and ambient show that electron transport to neighboring trap sites by tunneling is the main charge trapping mechanism in thin-MoS TFTs. This implies that interfacial traps account for most of the total sub-gap states while the bulk trap contribution is negligible, at approximately 0.40% and 0.26% in air and vacuum ambient, respectively. Thus, control of the interface trap states is crucial to further improve the performance of devices with thin channels.