1997
DOI: 10.1016/s0257-8972(97)00158-8
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Plasma-enhanced chemical-vapour-deposition of thin films by corona discharge at atmospheric pressure

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Cited by 105 publications
(81 citation statements)
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“…Dielectric barrier discharges have been examined for several material processes, including the cleaning of metal surfaces [57] and the plasma-assisted chemical vapor deposition of polymers [56] and glass films [58]. However, since the plasma is not uniform, its use in etching and deposition is limited to cases where the surface need not be smooth.…”
Section: Dielectric Barrier Dischargementioning
confidence: 99%
See 1 more Smart Citation
“…Dielectric barrier discharges have been examined for several material processes, including the cleaning of metal surfaces [57] and the plasma-assisted chemical vapor deposition of polymers [56] and glass films [58]. However, since the plasma is not uniform, its use in etching and deposition is limited to cases where the surface need not be smooth.…”
Section: Dielectric Barrier Dischargementioning
confidence: 99%
“…However, since the plasma is not uniform, its use in etching and deposition is limited to cases where the surface need not be smooth. For example, in the study of SiO deposition, it was found that the surface roughness exceeded 10% of the film thickness [58].…”
Section: Dielectric Barrier Dischargementioning
confidence: 99%
“…These materials comprise organically modified oxides [210], plasma-polymerized HMDSO coatings [211,212], so-called organically modified ceramics (ORMOCER [213]) and organically modified silicates (ORMOSIL [214]). One could also mention the hydrogenated amorphous carbon coatings [215][216][217], such as those developed by Moser et al that combine ductility and efficient barrier properties [218][219][220]. An alternative to develop new types of defect-tolerant high-barrier thin films could be based on theoretical analyses of mechanical contacts, that lead to optimal coatings with gradient in mechanical properties [221].…”
Section: Defect-tolerant High-barrier Thin Filmsmentioning
confidence: 99%
“…An ultrasonic atomic force microscopy (UAFM) are thought to be an advantageous tool for the detection of defects in comparison with a conventional atomic force microscopy (AFM) [3] and scanning electron microscopy (SEM). A cross-sectional high-resolution transmission electron microscopy (TEM) can also serve to detect defects, however, sample making prior to the observation is not easy, which causes damages of the sample during the sample making [4].…”
Section: Introductionmentioning
confidence: 99%