Plasma pretreatment of polycarbonate substrates for indium zinc oxide film deposition

Zhang, Xuan; Lang, J. M.; Zhang, Xiaofeng; Zhong, Yanli; Li, Lei

doi:10.1002/sia.6142

Cited by 7 publications

(5 citation statements)

References 26 publications

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“…Compared to polymethyl methacrylate, polycarbonate (PC) with higher impact resistance, heat resistance and good optical properties can better meet the high Mach number and bird impact resistance of the aircraft canopy. PC has important application prospects and values which will become one of the main application materials of aeronautical transparencies [8]. ITO films deposited on the PC surface are an important method to achieve radar stealth [9], and its mechanical durability is a primary issue at present.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Tensile Cracking in Indium Tin Oxide Films on Polycarbonate Substrates

Zhou

Zhang

et al. 2022

Coatings

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The electro-mechanical behaviors of transparent conductive oxide film on polymer substrate are of great concern because they would greatly affect the stability and lifespan of the corresponding devices. In this paper, indium tin oxide (ITO) films with different thicknesses were deposited on a polycarbonate (PC) sheet; meanwhile, in situ electrical resistance, in situ scanning electron microscopy and profilometry were employed to record the electrical resistance, morphologies and residual stress in order to investigate the fracture behavior and electrical-mechanical properties of ITO films under uniaxial tension loading. The electrical resistance changes, crack initiation, crack propagation and crack density evolution of ITO films were systematically characterized by in situ tests. Three fracture stages of ITO films were summarized: Ⅰ crack initiation, Ⅱ crack propagation, Ⅲ crack saturation and delamination. The crack initiation and electrical failure in a thinner ITO film occurred at relatively higher applied tensile strain; namely, the ductility of the film decreased as the film thickness increased. Residual compressive stress was recorded in the ITO films deposited on PC at room temperature and increased as the film thickness increased. Intrinsic crack initiation strain (CIS*) showed an opposite thickness dependence to residual strain (εr); the increase in residual compressive strain was counteracted by the decrease of intrinsic cohesion, leading to an overall decrease in effective crack initiation strain (CIS) when the film thickness increased. In addition, integrated with a formulated mechanics model and the analysis of the three fracture stages under tension, the fracture toughness and interfacial shear strength were quantitatively determined. As the film thickness increased (in the range of 50~500 nm), the fracture toughness decreased and the films were more prone to crack, whereas the interfacial shear strength increased and the films were less likely to delaminate.

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Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Tensile Cracking in Indium Tin Oxide Films on Polycarbonate Substrates

Zhou

Zhang

et al. 2022

Coatings

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“…Koski et al also related the presence of residual stresses on a PC sheet as a cause of adhesion reduction between a coating and its PC substrate. Similarly, other authors concluded that the surface residual stresses of the PC substrate could affect the adhesion properties of thin films …”

Section: Resultsmentioning

confidence: 76%

“…Plasma treatment can produce undesirable side effects on the performance of the treated material . In this study, the appearance of geometric deformations in treated PC sheets were observed when the PC sheet was unscrewed from the stainless‐steel plate.…”

Section: Methodsmentioning

confidence: 84%

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Atmospheric pressure air plasma treatment to improve the 3D printing of polyoxymethylene

Muro-Fraguas

Sainz‐García

Pernía‐Espinoza

et al. 2019

Plasma Processes & Polymers

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Polyoxymethylene (POM), an excellent engineering material, shows drawbacks as a three‐dimensional (3D) printing material: (a) difficulties in the adhesion of the first‐printed layer and (b) thermal contractions during printing. In this study, an atmospheric pressure air plasma treatment is applied on a polycarbonate (PC)‐printing base. The effect of the plasma treatment parameters is studied. Chemical and morphological tests are conducted. Results shows that, in general, as the plasma exposure rises, so does the degree of oxidation of the PC surface and the adhesion of POM. However, care must be taken as thermal residual stresses may reduce adhesion. Finally, an increase in adhesion of up to 45% is achieved.

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“…(TCO) deposition in the aeronautic equipment [1,2]. TCO films, which combine high light transmission and electrical conductivity, are widely used [3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Effects of dielectric layer on ductility for dielectric/Au/dielectric multilayers on polycarbonate substrate

Zhou,

Zhang,

Zhang

et al. 2023

J. Phys. D: Appl. Phys.

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The ductility of transparent conductive films on polycarbonate (PC) substrate is of great concern as it significantly affects the stability and longevity of aeronautic equipment. Three types of dielectric/Au/dielectric multilayers, including ITO/Au/ITO (IAI), IZO/Au/IZO (ZAZ) and AZO/Au/AZO (AAA) were fabricated to obtain highly ductile films on thick rigid PC substrate. The ductility of multilayers was comparatively investigated using in situ scanning electron microscopy test and in situ electrical resistance test under uniaxial tension. The effect of dielectric layer on ductility was elucidated according to the results of film stress and elastic modulus, and analyzed using the energy release rate approach based on the mechanics model. The results of in situ tests revealed that the crack initiation strain by morphology and the conductive failure strain of AAA were found to be 1.04 ± 0.04% and 1.47 ± 0.07%, which were superior to those of IAI and ZAZ. This result can be attributed to differences in layer stress state and layer-substrate mechanical contrast induced by different dielectric layers. Although AAA has the lower fracture toughness, the higher compressive residual stress and the smaller elastic mismatch give AAA the smallest crack driving force under the same conditions, resulting in excellent ductility.

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Plasma pretreatment of polycarbonate substrates for indium zinc oxide film deposition

Cited by 7 publications

References 26 publications

Mechanical Properties of Tensile Cracking in Indium Tin Oxide Films on Polycarbonate Substrates

Mechanical Properties of Tensile Cracking in Indium Tin Oxide Films on Polycarbonate Substrates

Atmospheric pressure air plasma treatment to improve the 3D printing of polyoxymethylene

Effects of dielectric layer on ductility for dielectric/Au/dielectric multilayers on polycarbonate substrate

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