Plasma treatment for fluxless soldering

Deltschew, R.; Hirsch, D.; Neumann, H.; Herzog, Thomas; Wolter, K.-J.; Nowottnick, Mathias; Wittke, Klaus

doi:10.1016/s0257-8972(01)01181-1

Cited by 15 publications

(6 citation statements)

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“…The two main methods used for generating hydrogen radicals are the plasma-enhanced method [4,5] and the hot-wire (HW) method [6]. Plasma enhanced methods avoid the use of a flux; however, these methods are not cost effective because the equipment required for generating the plasma is expensive.…”

Section: Introductionmentioning

confidence: 99%

Comparison of metal oxide removal using hydrogen radicals generated by hot-wire and plasma-enhanced methods

et al. 2015

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Section: Introductionmentioning

confidence: 99%

Comparison of metal oxide removal using hydrogen radicals generated by hot-wire and plasma-enhanced methods

et al. 2015

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“…[5] Therefore, the use of a fluxless soldering process that have been subjected to plasma treatment has been proposed. [6] In this paper, we propose the elimination of carbonrelated contaminations from the surface of the raw material powder of Pb-free solders by using hydrogen radicals.…”

Section: Introductionmentioning

confidence: 99%

Reduction of the Oxide Layer on a Lead-Free Solder Material by Hydrogen Radicals

Kagata

Nakashima

Izumi

2009

Transactions of The Japan Institute of Electronics Packaging

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Recently, there has been a demand for lead (Pb)-free solders for use in the electronics industry. However, this poses a challenge in their practical applications because the main component of typical Pb-free solders is tin (Sn) and therefore these solders are prone to oxidize easily. In this paper, we propose a novel technique for the reduction of oxides of the powder which is the raw material of Pb-free solders, and which has Sn as its main component using NH 3 decomposed species generated using a hot-wire (HW) method. It is confirmed that the tin oxide can be reduced by this treatment and the re-oxidation of the solder is also suppressed. Moreover, it is also confirmed that this treatment is effective in controlling the particle size of the Pb-free solder. Further, we clarify that the activation energy of the reduction of the tin oxide is almost zero by this process is almost zero, which indicates that the temperature dependence of the reduction is low.

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“…Various flux-less soldering methods have been developed in the recent years including ion/atom sputtering, plasma-assisted method, and re-flow under the protection of noble metals and atmosphere etc. Every method has its own advantages and limitations [3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%