Development of a flux-less soldering method by ultrasonic modulated laser

Li, Ming Yu; Wang, Chunqing; Bang, Hee-Seon; Kim, Young Pyo

doi:10.1016/j.jmatprotec.2005.02.237

Cited by 25 publications

(5 citation statements)

References 10 publications

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“…Nowadays, the ultrasonic assisted soldering of light metals and alloys without use of flux are actual. Many researchers dealing with this issue [2][3][4][5][6][7][8][9]. Developing of lead-free solders for microelectronics was realized by authors [10,11].…”

Section: Introductionmentioning

confidence: 99%

Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

Kostolný

Koleňák

2016

KEM

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The effect of In addition to Zn-5Al on the interfacial reaction behaviors and mechanical properties of solder joints were investigated. It was found that addition of In decreasing the melting point of Zn-5Al solder. The segregation of In on grain boundary was observed. CuZn5 and Cu5Zn8 intermetallic phases were observed at joint interface. Segregation of In on grain boundary caused a significant decrease of strength of the Zn-5Al-In solder compared to Zn-5Al. Addition of 1% In to Zn-5Al solder resulted in a reduction of shear strength of 14 MPa. The interfacial microstructure, shear strength and fracture surfaces of Zn-5Al/Cu and Zn-5Al-1In/Cu solder joints were studied.

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Section: Introductionmentioning

confidence: 99%

Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

Kostolný

Koleňák

2016

KEM

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“…With the increasing awareness to the environmental protection, lead containing materials which are quite widely applied as bonding material in electronic packaging technologies but are harmful to the environment and human body have been prohibited by many countries [1,2]. Accordingly, leadfree solder systems such as Sn-Cu, Sn-Ag-Cu, and Sn-Bi have been well studied in recent twenty years, but there are still some inevitable drawbacks which hinder the large-scale replacement of tin-lead solder in all areas.…”

Section: Introductionmentioning

confidence: 99%

Large‐Scale Synthesis of Silver Nanoparticles by Aqueous Reduction for Low‐Temperature Sintering Bonding

Xiliang

Cao

Lin

et al. 2014

Journal of Nanomaterials

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Silver nanoparticles with average diameter of 22.4 nm were prepared by aqueous reduction method for low-temperature sintering bonding application. The reaction temperature and PVP concentration, which are the influential factors of nanoparticle characteristics, were investigated during reduction process. In our research, monodispersity of nanoparticles was remarkably improved while unfavorable agglomeration was avoided with the AgNO3/PVP mass ratio of 1 : 4 at the reaction temperature 30°C. Besides, copper pads were successfully bonded using sintering paste employing fresh silver nanoparticles with diameter of 20~35 nm at 200°C. In addition, after morphology of the bonding joint was analysed by scanning electron microscope (SEM), the porous sintering characteristics were confirmed.

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“…Recently, a laser reflow soldering process was introduced in industry for practical use because of its low cost and its unique properties such as localized and non-contact heating, rapid rise and fall in temperature, and ease of automation as compared to the reflow soldering process. However, there has been limited discussion on the basic phenomena of the laser reflow soldering process and the performance of the joints soldered by this process [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%