Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect

Abstract

Abstrak Rangkaian elektronik terpadu harus dikemas untuk perlindungan dari pengaruh lingkungan seperti temperatur, tekanan dan benturan. Makalah ini menyajikan analisa visualisasi aliran fluida pada proses pengemasan (encapsulation process) IntroductionThe EMC rheology properties play an important role during the encapsulation process. It is because the final physical properties of EMC and processing rely on it. Rheology is defined as the science of flow and deformation of matter [1]-[4]. The most common models of rheology are the Castro-Macosko model. It is especially used in thermoset polymer rheology [4].The effect of gaps between die top and mold cap surface and between adjacent dies on EMC rheology during stacked-chip scale packages (S-CSP) encapsulated was studied by Abdullah MK et al. [4]. Rheokinetic simulation of mold filling behavior, mold void and wire sweeping dependences of gate size was analyzed by Lee MW et al. [5].In the present study, the computational fluid dynamic (CFD) code FLUENT 6.3 [6] is used to analyze the effect of rheology on the flow behavior of the encapsulation process of PBGA. The three dimensional models are developed and analyzed by using finite volume method. Flow behavior of encapsulant is modeled by Castro-Macosko with curing kinetic model by using user