“…The creep behavior of a number of HEA systems has been studied in a range of temperatures, including the Al 0.15 CoCrFeNi HEA with a face-centered cubic (fcc) structure at 580-700°C, 29 the Al 0.6 CoCrFeNi HEA with fcc and body-centered cubic (bcc) phases at 580-700°C, 29 the Ni 47.9 Al 10.2 Co 16.9 Cr 7.4 Fe 8.9 Ti 5.8 Mo 0.9 Nb 1.2 W 0.4 C 0.4 HEA with fcc 1 L1 2 phases at 750-982°C, 30 the Al 0.3 CoCrFeNi HEA with an fcc structure at room temperature, 31,32 the AlCoCrFeNi HEA with a bcc structure at room temperature, 32 the CoCrFeMnNi HEA with an fcc structure at room temperature, 33 the as-deposited CoCrFeCuNi HEA film with an fcc structure at room temperature, 34,35 the annealed CoCrFeCuNi HEA film with an fcc 1 bcc structure at room temperature, 34 the as-deposited CoCrFeCuNiAl 2.5 HEA film with a bcc structure at room temperature. 35 The creep response of these alloys at room temperature was mostly characterized by spherical nanoindentation tests 33,34 or Berkovich nanoindentation tests 31,32,35 by virtue of the highly localized stress field generated in these circumstances, whereas uniaxial creep tests 30 and stress-relaxation tests 29 were utilized for elevated-temperature probing. Focus was placed on determining the value of such critical material parameters as the stress exponent (n) and activation volume (V*), from which creep mechanisms are likely to be deduced.…”