2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00122
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Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

Toyohiro Aoki
1
,
Eiji Nakamura
2
,
Sayuri Kohara
3
et al.
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Cited by 6 publications
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