Polaris - A Low Cost MEMS Fabrication Platform for Navigation-Grade Inertial Sensors

Lin, David C.; MacDonald, Robert; Calbaza, D.E.; Popp, J.D.; Johnson, Tammy; Andarawis, Emad; Aimi, M.

doi:10.1109/inertial51137.2021.9430465

Cited by 5 publications

(4 citation statements)

References 3 publications

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“…Prior to testing of the integrated gyroscope system, subcomponent testing was conducted to validate functionality across the temperature range and assess feasibility for long term operation at 300°C. Short term testing of the MEMS MRG resonance and quality factor was conducted from room temperature to 600°C and shown to maintain functionality [5]. The MRG was further tested unbiased for 2412 hours at 300°C and measured periodically over 9 intervals within the test time with no significant change of performance observed over the test duration [5].…”

Section: Subcomponent Evaluationmentioning

confidence: 99%

“…Short term testing of the MEMS MRG resonance and quality factor was conducted from room temperature to 600°C and shown to maintain functionality [5]. The MRG was further tested unbiased for 2412 hours at 300°C and measured periodically over 9 intervals within the test time with no significant change of performance observed over the test duration [5]. The MRG control and readout SOI ASIC was tested for performance from 25°C to 300°C.…”

Section: Subcomponent Evaluationmentioning

confidence: 99%

See 1 more Smart Citation

High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C Operation

Andarawis,

Shaddock,

Popp

et al. 2023

IMAPSource Proceedings

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Conventional oil and gas drilling measurement while drilling (MWD) systems are typically designed to operate at temperatures <200°C. To increase the efficiency of drilling unconventional geothermal wells, downhole MWD tools are needed that can operate in the unique thermal challenges encountered in enhanced geothermal systems (EGS). GE demonstrated a 300°C downhole navigation system. The system utilizes GE’s internally developed state-of-the-art MEMS multiple ring Gyroscope (MRG), and a high temperature gyroscope control and readout application specific integrated circuit (ASIC). The MRG, ASIC and associated high temperature, high reliability packaging were integrated to demonstrate the performance and functionality of the gyroscope across the temperature range from room temperature to 300°C. Specialized long-term capable high temperature test platforms were developed to enable the characterization and testing of the gyroscope system and utilized to validate application-relevant lifetime capability.

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Section: Subcomponent Evaluationmentioning

confidence: 99%

Section: Subcomponent Evaluationmentioning

confidence: 99%

High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C Operation

Andarawis,

Shaddock,

Popp

et al. 2023

IMAPSource Proceedings

View full text Add to dashboard Cite

show abstract

“…Its minimum value is set by the process aspect ratio, a value which usually lies in the order of 30 for industrial processes (e.g. a 30 µm structural thickness for a 1 µm gap, [50,51]). In principle, reducing the gap value boosts the sensitivity.…”

Section: Open-loop Architecturesmentioning

confidence: 99%

“…According to the discussion above, offset is primarily determined by the micromechanics, while noise is determined by a combination of electronic and mechanical sources: the former are usually dominant in low-power applications where the current budget is limited; the latter represent the ultimate noise limit and are dominant whenever electronic noise can be lowered at the cost of an increased current consumption. Achieved performances for parallel plate silicon capacitive accelerometers are similar for in-plane and out-of-plane devices as long as the process thickness is limited to few tens µm; for growing process thickness up to more than 100 µm, in-plane sensors become, in general, more performing than out-of-plane ones [50,51].…”

Section: Open-loop Architecturesmentioning

confidence: 99%

Silicon MEMS inertial sensors evolution over a quarter century

Langfelder

Bestetti

Gadola

2021

J. Micromech. Microeng.

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Silicon-based microelectromechanical systems (MEMS) inertial sensors have become ubiquitous, revolutionizing motion sensing, vibration sensing and accurate positioning in several societal fields. Driven by consumer and automotive markets, companies involved in this technological development focused mostly on low cost, miniaturization and low power consumption, somewhat sacrificing measurement accuracy. In several laboratories all over the world, however, the research toward higher-performance sensors has been going on for more than two decades, with the goal of improving two key parameters for future applications: noise density and bias stability. This review article summarizes, for silicon-based MEMS accelerometers and gyroscopes, the most relevant working principles that appeared in the scientific literature. The collection of several data about the above mentioned key figures enables tracing the roadmap for further developments in the upcoming decade.

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The Intersection of Noise, Amplitude, and Nonlinearity in a High-Q Micromechanical Torsion Pendulum

Pratt,

Schlamminger,

Agrawal

et al. 2024

NODYCON Conference Proceedings Series

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Polaris - A Low Cost MEMS Fabrication Platform for Navigation-Grade Inertial Sensors

Cited by 5 publications

References 3 publications

High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C Operation

High Temperature Inertial Navigation Sensors, Electronics and Packaging for reliable 300°C Operation

Silicon MEMS inertial sensors evolution over a quarter century

The Intersection of Noise, Amplitude, and Nonlinearity in a High-Q Micromechanical Torsion Pendulum

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