Polymer Core BGA Stress Analysis at Minimal Vertical Loading

Vairavan

2014

AMR

The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.

Section: Methodsmentioning

confidence: 99%

LED Heat Dissipation Analysis Using Composite Based Cylindrical Slug

Vairavan

2014

AMR

“…The values for the low (-1) and high (+1) levels were based on the control parameters. The set of experimental combinations systematically study the interrelations and correlations between the factors towards the response used in the study [15][16][17][18]. The list of parameters deployed in the experiment was presented in Table 2.…”

Section: Methodsmentioning

confidence: 99%

Effect of High Temperature during Electroless Nickel Process

Hashim

et al. 2014

AMR

This paper presents the correlation between electroless process time, immersion gold process time and the bump height in electroless nickel immersion gold (ENIG). A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 100 °C. It can be concluded that electroless nickel time has more influence to the bump height compared to immersion gold time.

“…For the thermal analysis, 10 node tetrahedral thermal solid (SOLID 87) element was used to develope the 3D single chip LED model The contact regions in the 3D model defined using 3D 8 Node surface to surface contact (CONTA174) and 3D Target Segment (TARGE170) [8]. The 3D model consisted of 220016 tetrahedral elements with grid independence.Natural convection, h= 5 W/m 2 C was applied to the whole boundary of the model with ambient temperature was set at 25°C.…”

Section: Methodsmentioning

confidence: 99%

5mm × 5mm Sized Slug on High Power LED Stress and Junction Temperature Analysis

Fuad

et al. 2013

AMM

Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm x5mmx 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively.