Pool Boiling of FC-72 and HFE-7100

Abstract

This work reported the boiling characteristics of FC-72 and HFE-7100 at atmospheric pressure and at a liquid subcooling of 0–20 K. The FC-72 exhibits a more efficient nucleate boiling mode and a higher critical heat flux (CHF) than the HFE-7100. For film boiling mode, HFE-7100 becomes more efficient.

Effect of surface orientation on nucleate boiling and critical heat flux of dielectric fluids

“…4, the heat transfer coefficients for HFE-7100 are greater than those for FC-72, especially at high heat fluxes; this is in agreement with some literature reports [4,14,15], but contradicts [13].…”

“…In experiments on saturated and subcooled pool boiling at atmospheric pressure, Liu et al [13] noticed that FC-72 exhibited greater efficiency and a higher critical heat flux than HFE-7100 in the nucleate boiling mode. In the film boiling mode, however, this pattern was inverted.…”

“…While several studies [1][2][3] have dealt with the boiling of the fluorinert FC-72 (C 6 F 14 ), few have investigated HFE-7100 [4][5][6]. This new hydrofluoroether (C 4 F 9 OCH 3 ) dielectric fluid has recently been proposed to replace FC-72, as it has similar thermophysical properties and better environmental characteristics (lower GWP Global Warming Potential).…”

Advanced Spreaders for Enhanced Cooling of High Power Chips

“…Thus, is it desirable to increase the removal rate of the thermal power dissipated by the chip and mitigate the effect of the surface hot spots, while maintaining acceptable junctions' temperature (< 85 -125 o C depending on the application, ITRS (2009)). Nucleate boiling of dielectric liquids, such as FC-72, HFE-7100 and PF-5060, has been the subject of many investigations for potential application to immersion cooling of high power chips, Anderson and Mudawar (1989); Liu et al (2001); Honda and Wei (2003); Lin and Banerjee (2008); El-Genk et al (2007); El-Genk and Saber (2008); ElGenk (2012); Rainey and You (2000); Chang and You (1997). Besides their relatively low saturation temperatures (54 -61 o C at atmospheric pressure), these liquids are chemically inert, environmentally friendly and compatible with many structural materials of interest.…”

“…Porous, micro-porous, macro-structured, and macro-and microfinned surfaces and surfaces with micro-porous coatings have been shown to enhance nucleate boiling of dielectric liquids, Reed and Mudawar (1997), Chang and You (1997); Launay et al (2006); Liu et al (2001); El-Genk and Parker (2005) ;Ferjančič et al (2006); El-Genk and Ali (2010). The measured enhancements in the nucleate boiling heat transfer coefficient on these surfaces, compared to plane Cu, have been attributed to increases in the surface density of active sites for bubbles nucleation.…”