POSS-benzocyclobutene (POSS-BCB) resin

Su, Tao; Men, Weiwei; Wang, Zhiqiang; Xuan, Lixin; Zhao, Weiwei

doi:10.1177/0954008317740194

Cited by 14 publications

(9 citation statements)

References 38 publications

(50 reference statements)

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“…The selection of BCB to functionalize POSS is because it is a weakly polarized group and can be directly converted to polymer networks with excellent thermo‐mechanical properties, relatively low k values and good hydrophobicity. [ 52,53 ] Although it has been applied for partially modification of T 8 POSS and double‐decker silsesquioxane, [ 54,55 ] T 8 , T 10 , and T 12 POSS with fully functionalized BCB groups have never been reported. Our results indicate that the k values of obtained materials are linearly reduced ( k = 2.24 for c ‐T 8 B 8 , 2.02 for c ‐T 10 B 10 , and 1.83 for c ‐T 12 B 12 ) but other properties such as thermal stability, mechanical properties, surface smoothness and hydrophobicity do not show any decline (even slightly enhance) with increasing the cage volumes.…”

Section: Introductionmentioning

confidence: 99%

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Zhou

Guo

et al. 2021

Adv Funct Materials

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Polyhedral oligomeric silsesquioxanes (POSS) are of considerable interest as building blocks for preparing low‐k materials. To date T8 POSS has been extensively investigated while the potential of larger POSS cages remain an unexplored area. Herein, the first known contribution to map the role of POSS cage size on the dielectric and other comprehensive properties of hybrid materials with identical chemical compositions is described. First, three vinyl POSS (T8, T10, and T12) species are isolated from a commercial POSS mixture. Then, they are converted to benzocyclobutene functionalized and thermo‐crosslinked hybrid materials. It is found that the cage size can strongly affect their k values, more importantly, showing a linear decrease while increasing the cage volumes (k = 2.24, 2.02, and 1.83 for c‐T8B8, c‐T10B10, and c‐T12B12, respectively). This finding highlights a profound influence of POSS cage changes on dielectric properties and could be used to predict ultralow‐k (1.5–1.1) materials by extrapolating to larger T14, T16, and T18 POSS cages. Meanwhile, varying the cage size has no obvious effect on the materials’ other properties, and all of them exhibit good comprehensive properties. Moreover, such low‐k values can persist at high temperature and high humidity conditions, which affords some promising (ultra)low‐k dielectrics for modern integrated circuit development.

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Section: Introductionmentioning

confidence: 99%

Polyhedral Oligomeric Silsesquioxanes Based Ultralow‐k Materials: The Effect of Cage Size

Zhou

Guo

et al. 2021

Adv Funct Materials

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“…have been considered as ideal pore generators for reducing the materials' k values. [15,[25][26][27][28][29][30][31][32] Meanwhile, the organic-inorganic hybrid nature and high reactivity of POSSs endow the resulting materials high thermal [28,[32][33][34][35] and mechanical performance, [36,37] large surface area and pore volume, [38][39][40][41] and unique surface properties. [42,43] Recently, we demonstrated that larger POSS (i.e., T 10 and T 12 POSSs) is better nano-building block and filler for fabricating thermally and mechanically robust low-k materials.…”

Section: Introductionmentioning

confidence: 99%

High‐Performance Low‐kPoly(dicyclopentadiene) Nanocomposites as Achieved via Reactive Blending with Norbornene‐Functionalized Larger POSS

Wang

Xiong

Zhou

et al. 2023

Macro Materials & Eng

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Low dielectric constant (k) polymers with excellent comprehensive properties are useful materials in the microelectronics industry as matrix resins or encapsulation layers. With the inherent low polarization, high reactivity, good processability, and low cost, poly(dicyclopentadiene) (PDCPD) has received considerable attention as low‐k materials. However, its practical application is limited by the relatively high thermal expansion and k value. Herein, three norbornene‐functionalized polyhedral oligomeric silsesquioxanes (POSSs) with T8, T10, and T12 polyhedral cores are synthesized and employed for enhancing the dielectric and comprehensive properties of PDCPD via reactive blending. The results show that these POSSs have good compatibility with PDCPD matrix and nano‐dispersed POSSs particles could be obtained. As a result, the materials’ properties can be largely enhanced by varying the POSS content and POSS size. Especially, PT12N12‐40 (40 wt% of T12N12) shows the lowest k value (2.1) and coefficient of thermal expansion (63.4 ppm°C−1), highest glass transition temperature (202.5 °C), yield strength (78.0 MPa), and elastic modulus (2.36 GPa), along with excellent hydrophobicity. This study highlights a useful strategy to fabricate high‐performance low‐k polymer nanocomposites by using larger POSS and reactive blending, which provides useful materials for the future microelectronic industry and high frequency communication.

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“…[17][18][19] For decades, researchers have focused on improving the thermostability of resins by introducing rigid groups such as phenyl, 20,21 norbornyl, 22,23 and adamantyl 24,25 groups into the Si-O-Si main chain or side chains. Permittivity can be reduced by introducing fluorine groups [26][27][28] or cage structures 18,29,30 by hydrosilylation and/ or Heck reactions. The introduction of rigid groups improves the thermal stability of BCB resin to a certain extent, but reduces its molecular flexibility.…”

Section: Introductionmentioning

confidence: 99%