A series of diamine-based benzoxazine precursors have been prepared using 4,4 0 -diaminodiphenyl methane, formaldehyde, and different phenol derivatives including phenol, p-cresol, and 2-naphthol. Their chemical structures were identified by FTIR, 1 H NMR, and elemental analysis. The curing reactions of those precursors were monitored by FTIR and DSC. The obtained materials exhibited higher glass transition temperature and char yields than the corresponding bisphenol-A based polybenzoxazines.The polybenzoxazine prepared from phenol showed the highest char yields of 65% and thermal stability with 5 and 10% weight-loss temperatures at 346 and 4328C, respectively. The polybenzoxazine prepared from 2-naphthol exhibited the highest glass transition temperature at 2448C.

A novel benzoxazine precursor containing phenol hydroxyl groups was synthesized from bisphenol A, 4,4 0 -diaminodiphenyl methane, and formaldehyde with a molar ratio of 2:1:4. The benzoxazine precursor was characterized with Fourier transform infrared, proton nuclear magnetic resonance, and size exclusion chromatography. The curing reaction was monitored by the gel time, differential scanning calorimetry, and Fourier transform infrared. The obtained polybenzoxazine showed high thermal stability and a high glass-transition temperature.

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Organic-inorganic hybrid materials with a high thermal stability and a low dielectric constant show great potential in the microelectronics industry. In this work, polyhedral oligomeric silsesquioxane-benzocyclobutenes (POSS-BCBs) were synthesized by a hydrosilylation reaction of octavinyloctasilasesquioxane (OVPOSS) and 4-(1,1-dimethyl-1-hydro)-silyl-benzocyclobutene with H2PtCl6 as a catalyst. The ring-opening reaction of BCB on POSS-BCBs resulted in POSS-BCB resins with a highly cross-linked network structure. This resin exhibited good thermal stability (T5% is 495°C in N2), low dielectric constants (<2.1 at 20 MHz) and low water absorption.

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