Precision drilling of metals and ceramics with short- and ultrashort-pulsed solid state lasers

Foehl, Christian; Breitling, Detlef; Jasper, K.; Radtke, Joachim; Dausinger, Friedrich

doi:10.1117/12.456897

Cited by 24 publications

(7 citation statements)

References 3 publications

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“…This simplified characterization of the beam propagation is sufficient for the intended feasibility analysis. A more detailed discussion of the working principle of the helical drilling optics 44 , 45 , 50 and the resulting 3D movements of the beam is not necessary and is beyond the scope of this paper.…”

Section: Measurement Methodology and Definitionsmentioning

confidence: 99%

“…More details on the specific setup are given in Refs. 44–47. A beam deflector was placed in the path before the helical drilling optics to repeatedly relocate the position of the helical drilling process on the workpiece without having to move the helical drilling optics or workpiece and which must be accomplished without affecting the parameter of helical drilling or the beam.…”

Section: Motivation and Setupmentioning

confidence: 99%

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Feasibility assessment of parallelized helical drilling

2023

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With the average power of commercial ultrafast lasers reaching the kW-level, process parallelization is required to avoid detrimental quality issues, such as caused by heat accumulation. This is especially relevant in the case of helical drilling, as the processing strategy is only employed when precise geometry, high-quality surface finish, tight tolerances, and high reproducibility are a priority. We illustrate that parallelization by means of a multipass process is conceptually attractive for pulsed drilling processes, but also challenging due to limitations imposed by the properties of appropriate beam-steering devices. While paraxial beam propagation methods applied to the suggested setup predict no aberrations, deviations from the idealized solution are a concern. Our experimental proof-of-principle investigations show that parallelization by means of a deflector preceding the helical drilling optics is possible while ensuring nearly identical processing parameters for all parallelly processed boreholes.

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Section: Measurement Methodology and Definitionsmentioning

confidence: 99%

Section: Motivation and Setupmentioning

confidence: 99%

Feasibility assessment of parallelized helical drilling

2023

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“…Researchers [13][14] pointed out that the pulse duration is most favorable for fine micromachining on the picosecond scale, and the pulse width of around 10 ps is better for laser micromachining. When an ultrashort pulse laser acts on a transparent medium, free electrons will be generated.…”

Section: Methods Of Laser Machining Transparent Brittle Materialsmentioning

confidence: 99%

Laser machining of transparent brittle materials: from machining strategies to applications

Xie

Zhou

Wei

et al. 2019

Opto-Electronic Advances

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Transparent brittle materials such as glass and sapphire are widely concerned and applied in consumer electronics, optoelectronic devices, etc. due to their excellent physical and chemical stability and good transparency. Growing research attention has been paid to developing novel methods for high-precision and high-quality machining of transparent brittle materials in the past few decades. Among the various techniques, laser machining has been proved to be an effective and flexible way to process all kinds of transparent brittle materials. In this review, a series of laser machining methods, e.g. laser full cutting, laser scribing, laser stealth dicing, laser filament, laser induced backside dry etching (LIBDE), and laser induced backside wet etching (LIBWE) are summarized. Additionally, applications of these techniques in micromachining, drilling and cutting, and patterning are introduced in detail. Current challenges and future prospects in this field are also discussed.

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“…Its polygon mirror and laser pulse repetition rate synchronous scanning under the FPGA control system so that after a single scan, there is only one laser pulse injection at each scanning position. The benefit of the unique design of the polygon mirror structure is that the surface of the polygon mirror is smooth, effectively reducing the distortion of the scanning field and achieving the accuracy of ±5 μm, effectively reducing plasma shielding and the excessive heat-affected area [6,7] . Fig.…”

Section: Technical Principlesmentioning

confidence: 99%

Study on the treatment of titanium alloy template by high-speed laser polygon mirror scanning system

Liu,

Zhang,

Zheng

et al. 2023

Eighteenth National Conference on Laser Technology and Optoelectronics

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Laser scanning devices are indispensable for material surface treatment, laser drilling, and laser marking; due to the limited scanning speed, the traditional Galvanometer Scanning System is increasingly unable to match the high repetition rate laser. The scanning speed of the Polygon Mirror Scanner can reach 1000 m/s. Based on the FPGA (Field Programmable Gate Array) control system, the scanning speed of the Polygon Mirror Scanner can be synchronized with the pulse repetition rate of the nanosecond laser so that after a single scan, there is only one laser pulse injection at each scanning position. This paper mainly studies the processing of titanium alloy templates by high-speed Polygon Mirror Scanner and the influence of laser parameters and scanning parameters on the processing process. The processing depth will be changed by the reasonable adjustment of laser parameters. When the laser power reaches 500 W, the hole diameter can get 112 μm, the depth 156 μm, and the taper tends to be 0.325. There is a geometric relationship between scanning speed, laser pulse repetition rate, and scanning hole spacing, and different functions such as two-dimensional laser marking, laser drilling and laser scribing can be realized according to processing requirements. When the scanning speed of the Polygon Mirror Scanner exceeds 800 m/s, the pulse repetition rate is 500 kHz, the spacing between holes is 1.6 mm, the spacing between lines is 1.6 mm, the overall scanning times are 30 times, and the surface processing of about 4000-hole positions takes only 1.5 seconds. At the end of this paper, a typical application case is presented. There are thousands or even tens of thousands of micro-holes on the surface of titanium alloy templates processed by a high-speed Polygon Mirror Scanner. The template shows a good effect after the deposition of biological coating materials or related drugs and can be actively applied to the healing of traumatic bone tissue.

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Precision drilling of metals and ceramics with short- and ultrashort-pulsed solid state lasers

Cited by 24 publications

References 3 publications

Feasibility assessment of parallelized helical drilling

Feasibility assessment of parallelized helical drilling

Laser machining of transparent brittle materials: from machining strategies to applications

Study on the treatment of titanium alloy template by high-speed laser polygon mirror scanning system

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