Preferential orientation and thermoelectric properties of p-type Bi0.4Sb1.6Te3 system alloys by mechanical alloying and equal channel angular extrusion

Fan, Xiaoliang; Yang, Junyou; Zhu, Wen; Bao, Siqian; Duan, Xingkai; Xiao, Chengjing; Li, K.

doi:10.1016/j.jallcom.2007.07.007

Cited by 48 publications

(26 citation statements)

References 20 publications

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“…The formation of preferential orientations of {0001} mainly ascribed to significant axial strain in the hot pressing conditions of SPT process crystallographic texture develops due to slip, grain boundary sliding, grain rotations, and dynamic recrystallization. 24 The electrical resistivity of both the SPS and SPT samples remains almost unchanged but a slight deviation toward lower resistivity for the SPT samples is observed above 150 C. The room temperature values were found to be almost constant for SPS and SPT samples. While, it is expected that texturization leads to a decrease in the electrical resistivity, in the present case as there are however, more grain boundaries formed in the SPT sample (as compared to SPS sample) exhibiting higher electrical resistivity due to grain boundary scattering which is almost identical to SPS sample.…”

Section: -mentioning

confidence: 86%

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Enhanced thermoelectric performance in spark plasma textured bulk n-type BiTe2.7Se0.3 and p-type Bi0.5Sb1.5Te3

Bhame

Dhanapal

Prellier

et al. 2013

Applied Physics Letters

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Bulk p and n-type bismuth tellurides were prepared using spark plasma texturization method. The texture development along the uniaxial load in the 001 direction is confirmed from both x-ray diffraction analysis and electron backscattering diffraction measurements. Interestingly, those textured samples outperform the samples prepared by conventional spark plasma sintering (SPS) leading to a reduced thermal conductivity in the ab-plane. The textured samples of n-type BiTe2.7Se0.3 and p-type Bi0.5Sb1.5Te3 showed a 42% and 33% enhancement in figure of merit at room temperature, respectively, as compared to their SPS counterparts, opening the route for applications.

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Section: -mentioning

confidence: 86%

“…According to Mott equation, the Seebeck coefficient is sensitive to band structure near the Fermi level and is not affected by grain orientation. 24 However for P type compounds, in the extrinsic conduction region, the Seebeck coefficient can be expressed as…”

Section: -mentioning

confidence: 99%

Enhanced thermoelectric performance in spark plasma textured bulk n-type BiTe2.7Se0.3 and p-type Bi0.5Sb1.5Te3

Bhame

Dhanapal

Prellier

et al. 2013

Applied Physics Letters

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“…Using ball milling and the hot pressing or spark plasma sintering method, several groups have prepared nanocomposite Bi 0.4 Sb 1.6 Te 3 bulk samples. [2][3][4][5][6] The thermoelectric properties and the preparation methods are summarized in Table II. The ZT values of consolidated Bi 0.4 Sb 1.6 Te 3 alloys are shown in Fig. 8 as a function of temperature, including the results of our present work for comparison.…”

Section: Resultsmentioning

confidence: 99%

“…Several groups have prepared nanocomposite Bi 0.4 Sb 1.6 Te 3 bulk samples by using ball milling and the hot pressing or spark plasma sintering method. [2][3][4][5][6] A peak ZT value of 0.9 at 450 K was obtained by combining ball milling and spark plasma sintering. 3 An efficient TE material should have large Seebeck coefficient, high electrical conductivity, and low thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Thermoelectric Properties of Nano/microstructured p-Type Bi0.4Sb1.6Te3 Powders Fabricated by Mechanical Alloying and Vacuum Hot Pressing

Lee

Hao

Chao

et al. 2013

Journal of Elec Materi

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Two kinds of Bi 0.4 Sb 1.6 Te 3 powder with different particle and grain sizes were fabricated by high-energy ball milling. Powder mixtures with varied weight ratios were consolidated by vacuum hot pressing (HP) to produce nano/ microstructured composites of identical chemical composition. From measurements of the Seebeck coefficient, electrical resistivity, and thermal conductivity of these composites, a figure of merit (ZT) value of up to 1.19 was achieved at 373 K for the sample containing 40% nanograin powder. This ZT value is higher than that of monolithic nanostructured Bi 0.4 Sb 1.6 Te 3 . It is further noted that the ZT value of this sample in the temperature range of 450 K to 575 K is in the range of 0.7 to 1.1. Such ZT characteristics are suitable for power generation applications as no other material with a similar high ZT value in this temperature range has been observed until now. The achieved high ZT value can probably be attributed to the unique nano/ microstructure, in which the dispersed nanograin powder increases the number of phonon scattering sites, which in turn results in a decrease of the thermal conductivity while simultaneously increasing the electrical conductivity, owing to the existence of the microsized powder that can provide a fast carrier transportation network. These results indicate that the nano/microstructured Bi 0.4 Sb 1.6 Te 3 alloy can serve as a high-performance material for application in thermoelectric devices.

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“…4,5) Recently, ECAE process which is the heavy plastic deformation method was applied to bulk thermoelectric material. [6][7][8] This technique can accumulate strain in the work piece because during the process the specimen is severe plastically deformed without reduction of cross sectional size. Therefore, the ECAE process is effective in grain refinement of bulk materials than any other processes, and more favorable to reduce grain size under the condition of relatively low temperature and high strain rate.…”

Section: Introductionmentioning

confidence: 99%

Equal Channel Angular Extrued Bi0.5Sb1.5Te3 Thermoelectric Compound

Lim

Kim

et al. 2008

Mater. Trans.

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The effects of equal channel angular extrusion (ECAE) process parameters on microstructure and thermoelectric properties of the p-type Bi 0:5 Sb 1:5 Te 3 compound have been investigated. ECAE was carried out under various temperatures (653 K, 693 K, 733 K) and ram speeds (0.5 mm/s, 1 mm/s, 2 mm/s). Fraction of recrystallized grains and grain size was found to be increase with lower ram speed and higher deformation temperature. As a result, Seebeck coefficient increased, and electrical resistivity and thermal conductivity decreased. The decrease in thermal conductivity was attributed to the decrease of lattice thermal conductivity ( ph ) which is independent of electrical properties. Maximum figure-of-merit (2:87 Â 10 À3 K À1 ) was achieved in as-ECAE'ed specimen at 733 K and at ram speed of 0.5 mm/s. This value was found to be 6% higher than that of as-sintered specimen.

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Preferential orientation and thermoelectric properties of p-type Bi0.4Sb1.6Te3 system alloys by mechanical alloying and equal channel angular extrusion

Cited by 48 publications

References 20 publications

Enhanced thermoelectric performance in spark plasma textured bulk n-type BiTe2.7Se0.3 and p-type Bi0.5Sb1.5Te3

Enhanced thermoelectric performance in spark plasma textured bulk n-type BiTe2.7Se0.3 and p-type Bi0.5Sb1.5Te3

Thermoelectric Properties of Nano/microstructured p-Type Bi0.4Sb1.6Te3 Powders Fabricated by Mechanical Alloying and Vacuum Hot Pressing

Equal Channel Angular Extrued Bi<SUB>0.5</SUB>Sb<SUB>1.5</SUB>Te<SUB>3</SUB> Thermoelectric Compound

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