Preparation and Properties of Poly(imide-siloxane) Copolymer Composite Films with Micro-Al2O3 Particles

Choi, Ju Chan; Nam, Kyeong-Nam; Jin, Seung-Won; Kim, Dong-Min; Song, Inho; Park, Hyeong-Joo; Park, Sung Jin; Chung, Chan‐Moon

doi:10.3390/app9030548

Cited by 8 publications

(6 citation statements)

References 49 publications

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“…33 By comparison, the T d5 and Y r800°C of the cured PTISs in N 2 are higher than that of the poly(imide siloxane) copolymers without functional terminal groups, which have the same copolymer composition as PTISs. 34 On the contrary, the Y r800°C of the cured PTIS-100 in air decreases with incorporation of the aromatic MDA into the main chain of PTIS. The Y r800°C of the cured PTIS-100 in air is 15.9%, and that of the cured PTIS-60 can decreases by 69% indeed.…”

Section: Resultsmentioning

confidence: 99%

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

Yuan

Huang

2020

High Performance Polymers

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The novel propargyl ether-terminated oligo(imide siloxane)s (PTISs) based on 2,2’-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), aminopropyl-terminated polydimethylsiloxane (APPS), 4,4’-diaminodiphenylmethane (MDA) and p-aminophenyl propargyl ether (APPE) were synthesized. The chemical structures of PTISs were characterized by proton nuclear magnetic resonance (1H NMR) and Fourier transform infrared spectroscopy (FTIR). The PTISs exhibited excellent solubility in organic solvent and had broad processing window. The T300 carbon fabric was used to reinforce the PTIS matrices and prepare the composites (T300CF/PTISs). The thermal stability of the cured PTISs was analyzed by thermogravimetric analysis (TGA). The dynamic thermal mechanical properties of the composites were measured by dynamic thermomechanical analysis (DMA). The results show that the temperature at 5% weight loss (Td5) and residual yield at 800°C (Yr800°C) of the cured PTISs in N2 increase with incorporation of the aromatic diamine, whereas the Yr800°C of the cured PTISs in air decreases with introduction of the aromatic diamine. The elasticity of the composite increases with incorporation of the aromatic diamine, and the peak temperature of loss factor for the composites are higher than 300°C. The flexural strength, tensile strength and interlaminar layer shear strength (ILSS) of the T300CF/PTIS composite display the values of 439 MPa, 427 MPa and 32 MPa at room temperature, respectively. The retention of the flexural strength and ILSS for the T300CF/PTIS composite are above 80% at 250°C.

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Section: Resultsmentioning

confidence: 99%

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

Yuan

Huang

2020

High Performance Polymers

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“…Therefore, it can be added to the polymer matrix as a filler to improve thermal performance. Choi et al [26] used 6FDA, 4,4 0 -methylenedianiline, and bis(3-aminopropyl)-terminated polydimethylsiloxane to prepare PI films with different siloxane content. Since PI-3, PI-4 and PI-5 films were independent and flexible, PI/Al 2 O 3 composite films were prepared at different concentrations of Al 2 O 3 using these three PIs.…”

Section: Polyimide-based Composite Dielectric Materials 41 Simple Comentioning

confidence: 99%

“…Compared with traditional polysiloxane/Al 2 O 3 composite materials, PI/Al 2 O 3 composite films demonstrated improved thermal properties [26].…”

Section: Polyimide-based Composite Dielectric Materials 41 Simple Comentioning

confidence: 99%

High-Temperature Polyimide Dielectric Materials for Energy Storage

Zha¹,

Liu²,

Tian³

et al. 2021

Polyimide for Electronic and Electrical Engineering Applications

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The availability of high-temperature dielectrics is key to develop advanced electronics and power systems that operate under extreme environmental conditions. In the past few years, many improvements have been made and many exciting developments have taken place. However, currently available candidate materials and methods still do not meet the applicable standards. Polyimide (PI) was found to be the preferred choice for high-temperature dielectric films development due to its thermal stability, dielectric properties, and flexibility. However, it has disadvantages such as a relatively low dielectric permittivity. This chapter presents an overview of recent progress on PI dielectric materials for high-temperature capacitive energy storage applications. In this way, a new molecular design of the skeleton structure of PI should be performed to balance size and thermal stability and to optimize energy storage property for high-temperature application. The improved performance can be generated via incorporation of inorganic units into polymers to form organic-inorganic hybrid and composite structures.

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“…Polyimides are also known to have low dielectric constants and thermal conductivity, so they have been widely used in microelectronics, automobiles, and aerospace industries as electronic packaging and electrical insulating materials [18][19][20]. On the other hand, poly(imide-siloxane)s (PISs) have been synthesized using amine-terminated siloxane compounds [21][22][23][24][25][26][27][28]. By introducing the siloxane backbone into the polyimides, the PISs have some beneficial properties such as enhanced solubility, low temperature flexibility, thermal and UV stability, adhesive properties, oxidative resistance, and proton conductivity.…”

Section: Introductionmentioning

confidence: 99%

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

Park¹,

Choi²,

Jin³

et al. 2022

Polymers

Self Cite

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Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

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Preparation and Properties of Poly(imide-siloxane) Copolymer Composite Films with Micro-Al2O3 Particles

Cited by 8 publications

References 49 publications

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

High-Temperature Polyimide Dielectric Materials for Energy Storage

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

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