Preparation of gold patterns on polyimide coating via layer-by-layer deposition of gold nanoparticles

Fabrication of Gold Patterns via Multilayer Transfer Printing and Electroless Plating

“…The I – V curve shows ohmic behavior, indicating the formation of continuous metallic gold layer, which is consistent with the FE-SEM micrograph (Figure -D). The electrical conductivity was calculated as 2.5 × 10 5 Ω –1 cm –1 , which is higher than the previous works. ,,,, However, it is worthy to note that the conductivity is still lower than the value of bulk gold (4 × 10 5 Ω –1 cm –1 ), which could be attributed to the grain boundaries and defects, , as well as enhanced carrier scattering due to polycrystalline nature and high rms roughness of gold layer as reported previously …”

“…However, one may think that adhesion and the crack of the pattern could a be problem while fabricating metal patterns on flexible polymer substrates. Surface modification of the polymer substrate via plasma etching will solve the adhesion of the patterns to the substrate as shown previously. , Meanwhile, we believe that highly flexible substrate, including PI and PET as well as printed polyelectrolyte multilayer, will inhibit the crack formation of the metal pattern. In addition, crack formation was not reported in the previous works by Park and Huang, who prepared gold patterns on flexible PI and PET substrate, respectively.…”

Microcontact printing large-area pattern of catalytic Pd ink with a polyelectrolyte modified stamp for selective electroless deposition of nickel on glass substrate

“…2. The surface of rubber stamps were modified by immersion in 1000 ppm cationic poly(diallyldimethylammonium chloride); (PDDA, Mw < 100,000) or anionic (sodium poly(styrene sulfonate); (PSS, Mw $ 70,000) polyelectrolyte solution, respectively, for 2 h. We chose PDDA and PSS as polyelectrolytes for surface modification because this system has been most widely studied and documented [25,26]. The stamps were then briefly rinsed with water and blown dry with air.…”

“…Their results showed that palladium catalyst incorporated in dithiol layers initiated the electroless metal deposition on gold substrates. Similar, Basarir et al [25] fabricated gold patterns via the mCP of 3-aminopropyltriethoxysilane on plasma etched polyimide films, followed by the layer-by-layer (LBL) deposition of gold nanoparticles (GNPs), O 2 plasma etching, and sintering. Mewe et al [30] used mCP to pattern an aminosilaned self-assembled monolayer for adhering gold nanoparticles as a catalyst for further electroless silver plating.…”

“…Consequently, metal patterns can be achieved either by the selective activation of a nonreactive surface or by selective deactivation of a catalytically active substrate. The catalytic patterns can be created through photolithographic techniques [13,14], chemical vapor deposition [15,16], inkjet printing of a catalyst onto substrates [17][18][19][20] or micro-contact printing (mCP) of catalysts colloids [21][22][23][24][25][26][27], etc.…”