“…After heating for crystallization for 5 min, the sample was cooled down to Curie temperature to accomplish phase transition of cubicto-tetragonal, where either the [001] or [100] direction of the PZT crystal can align to the substrate surface depending on the degree of thermal stress; the PZT crystals on certain substrates with a larger coefficient of thermal expansion, sub , generally receive a larger thermal stress in compressive mode by the bimetallic effect to align the [001] direction of the PZT crystal, and vice versa. 14,[29][30][31] The crystal orientation determined at Curie temperature was consequently maintained during the cooling process down to room temperature. The sub values of SUS 316L and Inconel 625 are significantly larger than that of silicon wafer, approximately 16 Â 10 À6 , 13 Â 10 À6 , and 2:6 Â 10 À6 K À1 , respectively, which would determine the degree of crystal orientation of the PZT films on the ns-CN interface layer dominantly.…”