Process characterization and reliability for the assembly of 01005 chip components

Abstract

PurposeThe purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components.Design/methodology/approachDuring the study, solder paste printing process‐related variables, such as solder paste type, stencil type, and stencil opening ratio, and pick and place process‐related methods, such as vision camera type and vacuum pickup nozzle type were evaluated with the goal of achieving a high‐yield assembly solution for 01005 chip components. A test board was used in a series of designed experiments to optimize the solder paste printing, pick and placement, and reflow processes. Assembly defects were analyzed as a function of the stencil design and the assembly processes.FindingsThe results of the study indicated that both electroformed and electropolished laser‐cut stencils had a comparable print quality with respect to the solder volume delivered to the pads. In terms of assembly yield performance, type 4 (size range: 20‐38 μm) solder paste with a smaller sphere size gave a better overall yield and better paste deposition on the pad, if used on a 0.08‐mm thick electroformed stencil with a 90 per cent aperture. Temperature cycling between −65 and 150°C, with up to 1,500 cycles, showed that no cracks were observed at the solder joints due to temperature cycling. The process and design change required for achieving a robust manufacturing process have been indicated and reported.Originality/valueThe results of this work provide process recommendations for the implementation of 01005‐sized chip components assembly in mass production processes.

A grey-ANN approach for optimizing the QFN component assembly process for smart phone application

“…The design of experiments (DOE) is often used to determine the effects of factors and their potential interactions in a product or a process design with the ultimate aim of achieving good quality. Lee et al (2011) used DOE to improve the height of solder paste deposition, tombstoning, solder bridging and placement errors. Zhong et al (2005) investigated solder joint reliability when SnAgCu solder was used for assembling plastic ball grid array components.…”