Process characterization of PCB assembly using 0201 packages with lead‐free solder

Geiger, David; Mattsson, Fredrik; Shangguan, Dongkai; Ong, M.C.; Wong, P.L.; Wang, Mei; Castello, Todd; Yi, Sammy

doi:10.1108/09540910310479495

Cited by 6 publications

(1 citation statement)

References 2 publications

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“…al. [58] compared thermal cycling reliability of lead-free solder joints of chip resistors 2512. The board finish was ENIG and chip resistor finish was pure Sn.…”

Section: Experimental Results On Chip Resistorsmentioning

confidence: 99%

Lead-free Solder Joint Reliability – State of the Art and Perspectives

Pan

Wang

Shaddock

2005

Journal of Microelectronics and Electronic Packaging

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There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concern. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage.The solder joints reliability not only depends on the solder joint alloys, but also on the component metallization and PCB metallization. Reflow profile has significant impact on lead-free solder joint performance also because it influences wetting and microstructure of the solder joint. Majority researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture.

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“…al. [58] compared thermal cycling reliability of lead-free solder joints of chip resistors 2512. The board finish was ENIG and chip resistor finish was pure Sn.…”

Section: Experimental Results On Chip Resistorsmentioning

confidence: 99%