Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Chiang, Huann-Wu; Chung, Cho-Liang; Chen, Liu-Chin; Li, Yang; Wong, Ching‐Ping; Fu, Shen-Li

doi:10.1163/1568561054352487

Cited by 15 publications

(2 citation statements)

References 8 publications

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“…Polymer composite materials have versatile applications in electronic packaging because of their low-temperature processability and various functionalities endowed by other ingredients in the composites. Since silver filled polymer composites were first patented as conductive adhesives (ECAs) in 1956, the conductive adhesives have been proposed as one of the alternatives of tin/lead (Sn/Pb) solders. − Lead, one of components in the commonly used eutectic solder, has long been known as a hazard to human beings. Thus, worldwide regulations against the use of lead in electronics have become more apparent.…”

Section: Introductionmentioning

confidence: 99%

Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites

et al. 2006

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Silver nanoparticles were surface functionalized with diacids and then incorporated into the polymer matrix with silver flakes as conductive fillers. By using appropriate diacids, the resistivity of the silver flakes and nanoparticles (molar ratio of silver flakes to nanoparticles is equal to 6:4) incorporated polymer composites was dramatically reduced to as low as 5 × 10 -6 Ω‚cm. Morphology studies showed that the decreased resistivity resulted from the sintering of silver nanoparticles. The contact resistance of the polymer composites under 85 °C and 85% relative humidity was significantly stable with respect to aging time as a result of the further sintering of silver nanoparticles.

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Section: Introductionmentioning

confidence: 99%

Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites

et al. 2006

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“…The combination of different morphological fillers used in TCA system can increase the thermal conductive pathway, but also increase the thermal contact resistance. [33] Therefore, the mixing ratio of different morphological fillers in TCA that lead to high thermal conductivity is essential. In experiments, 5 wt% spherical nano-Ag is initially replaced by pristine spherical Cu particles and GCPs to compare thermal performances in TCAs, 75 wt% flake Ag remain unchanged.…”

Section: Manufacturing Graphene-encapsulated Copper Particles By Chemmentioning

confidence: 99%

Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor

Chen

Zehri

Wang³

et al. 2019

ChemistryOpen

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Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core–shell structure, we developed a facile manufacturing method to prepare graphene‐encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 °C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.

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Nanoparticles in Microvias

Das

Egitto

2008

Nanopackaging

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Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Cited by 15 publications

References 8 publications

Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites

Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites

Manufacturing Graphene‐Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor

Nanoparticles in Microvias

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