2017
DOI: 10.1364/oe.25.003966
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Processing constraints resulting from heat accumulation during pulsed and repetitive laser materials processing

Abstract: In any pulsed and repetitive laser process a part of the absorbed laser energy is thermalized and stays in the material as residual heat. This residual heat is accumulating from pulse to pulse, continuously increasing the temperature, if the time between two pulses does not allow the material to sufficiently cool down. Controlling this so-called heat accumulation is one of the major challenges for materials processing with high average power pulsed lasers and repetitive processing. Heat accumulation caused by … Show more

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Cited by 65 publications
(47 citation statements)
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“…The lower part exhibits more peaks and pits, suggesting that more thermal losses take place as the beam penetrates deeper into the kerf line as a result of the hydrodynamic plasma expansion and the incoming beam shielding [27]. Although the femtosecond regime does not favor the thermally activated matter removal, the heat accumulation resulting from a high repetition rate at the bottom of the kerf line can partially activate this ablation mode [28]. The latter regime is consistent with the formation of a crater-like rougher surface, as shown in Figure 5d.…”
Section: Characterization Of the Laser Cut Surfacementioning
confidence: 99%
“…The lower part exhibits more peaks and pits, suggesting that more thermal losses take place as the beam penetrates deeper into the kerf line as a result of the hydrodynamic plasma expansion and the incoming beam shielding [27]. Although the femtosecond regime does not favor the thermally activated matter removal, the heat accumulation resulting from a high repetition rate at the bottom of the kerf line can partially activate this ablation mode [28]. The latter regime is consistent with the formation of a crater-like rougher surface, as shown in Figure 5d.…”
Section: Characterization Of the Laser Cut Surfacementioning
confidence: 99%
“…Since this is small compared to the diameter d s = 500 µm of the beam on the workpiece used in this study, 1D heat flow can be assumed for the time between two consecutive pulses [9]. For the larger number N pps = d s ⋅ f/v feed of pulses incident on one spot during a single pass of the laser beam, the thermal diffusion length modifies to [10]. With d s = 500 µm, the 1D approximation of the heat flow induced by one isolated single pass of the laser beam is, therefore, justifiable for feed rates well above 0.03 m/s.…”
Section: Introductionmentioning
confidence: 99%
“…Alternatively, this may lead to an unwanted widening of the inlet of the hole. Within the hole, a reduced available fluence can lead to the formation of thermal damage due to heat accumulation [7][8][9].…”
Section: Introductionmentioning
confidence: 99%