Product Level Accelerated Reliability Testing of Motor Drives With Input Power Interruptions

Pippola, J.; Vaalasranta, Ilkka; Marttila, Tuomas; Kiilunen, Janne; Frisk, Laura

doi:10.1109/tpel.2014.2359734

Cited by 21 publications

(9 citation statements)

References 17 publications

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“…In [60]- [62], the PC test is performed under converter operation with real inductive loads or motors. However, the PC test with real loads is not cost-effective because real loads consume large power during a long test period.…”

Section: B Ac Power Cycling Test Circuit Close To Real Convertermentioning

confidence: 99%

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

183

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Power cycling test is one of the important tasks to investigate the reliability performance of power device modules in respect to temperature stress. From this, it is able to predict the lifetime of a component in power converters. In this paper, representative power cycling test circuits, measurement circuits of wear-out failure indicators as well as measurement strategies for different power cycling test circuits are discussed in order to provide the current state of knowledge of this topic by organizing and evaluating current literature. In the first section of this paper, the structure of a conventional power device module and its related wear-out failure mechanisms with degradation indicators are discussed. Then, representative power cycling test circuits are introduced. Furthermore, on-state collector-emitter voltage (V C E O N ) and forward voltage (V F ) measurement circuits for wear-out condition monitoring of power device modules during power cycling test are presented. Finally, different junction temperature measurement strategies for monitoring of solder joint degradation are explained.Index Terms-Failure mechanism, insulated gate bipolar transistor (IGBT), power cycling (PC) test, power device module, reliability, wear-out failure.

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Section: B Ac Power Cycling Test Circuit Close To Real Convertermentioning

confidence: 99%

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

183

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show abstract

“…However, the disadvantage of this method is clear that the DUT does not operate under the realistic electrical conditions [22], and uncertainties will be added to the test result analysis. Thus, AC power cycling test, which enables the power devices operating under more actual load conditions attracts more attention nowadays [23]. The proposed mission profile emulator is able to conduct the AC power cycling testing for the power devices with an acceptable power consumption for a long testing.…”

Section: A Capability I -Ac Power Cycling Testingmentioning

confidence: 99%

A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters

Wang

Zhang

et al. 2019

IEEE Trans. Power Electron.

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Various methods have been presented in the past to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for the reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and to investigate its feasibility for reliability testing and thermal model validation of the power modules in the MMC. The proposed mission profile emulator has three distinctive features: 1) Capable of emulating and measuring the thermal stresses of power modules; 2) Capable of implementing practical switching profile as a full-scale MMC; and 3) Having significantly reduced requirement for DC power supply compared to existing setups used for electrical studies. Theoretical discussions, and simulations as well as the experimental results are presented to demonstrate the capability of the mission profile emulator both electrically and thermally. Moreover, this paper is accompanied by a video demonstrating how to measure the junction temperature of the power devices using the optical fiber and the thermal camera.

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“…It means that there are only losses by two IGBT modules and load inductors. Thus, it is a cost-effective solution compared to power cycling test with real loads [19]. Fig.…”

Section: Accelerated Power Cycling Test Under Different Junctionmentioning

confidence: 99%

Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules

Choi

Blaabjerg

Jørgensen

2017

IEEE Trans. Power Electron.

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Product Level Accelerated Reliability Testing of Motor Drives With Input Power Interruptions

Cited by 21 publications

References 17 publications

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

A Viable Mission Profile Emulator for Power Modules in Modular Multilevel Converters

Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules

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