Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system

Ho, Cheng–En; Fan, C. W.; Hsieh, W.Z.

doi:10.1016/j.surfcoat.2014.04.027

Cited by 39 publications

(4 citation statements)

References 28 publications

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“…그 중에서 Cu 기판 사용시, 일반적인 솔더합금과의 빠른 반응 특성으로 인 해 계면에 Cu 6 Sn 5 및 Cu 3 Sn 등과 같은 Cu-Sn계 금 속간 화합물(intermetallic compound, IMC)의 빠른 생성으로 인한 기계적 신뢰성 저하 문제가 많이 보고되어 왔다 4,5) . 이를 개선하기 위하여 확산 방지층(diffusion barrier layer)의 역할을 하는 Ni 도금 기술이 적용되 었으며, 주로 무전해 도금 기술인 ENIG 및 ENEPIG 도금 층이 널리 사용되어져 왔다 [6][7][8][9][10][11][12][13] . 솔더링…”

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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

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et al. 2017

Journal of Welding and Joining

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A new multilayer metallization, ENEPIG (electroless nickel electroless palladium immersion gold) with 0.1㎛ thin Ni(P) layer (thin-ENEPIG), was plated on a Cu PCB substrate for fine-pitch package applications. We evaluated interfacial reactions and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate during various reflow times. In the initial soldering reaction, (Au,Cu)Sn 4 intermetallic compound (IMC) formed at the SAC305/ENEPIG interface. After prolonged reflow reactions, the Pd and Ni layers were consumed, and (Cu,Ni) 6 Sn 5 IMC formed on the Cu layer. As the reflow time increased, the Cu and Ni contents in (Cu,Ni) 6 Sn 5 IMC increased and decreased, respectively, due to the limited Ni layer in the ENEPIG plating layer. In the low-speed shear test, all fractures occurred in the bulk solder regardless of reflow times. In the high-speed shear test, the fracture mode was changed from ductile to brittle with increasing reflow time, due to the formation of the thick interfacial IMC.

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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

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유

한

et al. 2017

Journal of Welding and Joining

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“…As the solid-state aging time increased, the needle-type morphology of Ni 3 Sn 4 changed to a chunk-type morphology, and the Ni 3 P layer thickened. The Ni-Sn-P layer was supposed to be present between the Ni 3 Sn 4 and Ni 3 P layer [ 15 , 16 , 17 , 18 , 19 , 20 , 21 , 22 ]. However, after solid-state aging, it was not distinguished without the spalling of Ni 3 Sn 4 IMCs.…”

Section: Resultsmentioning

confidence: 99%

“…Experiments to verify the usefulness and mechanical reliability of ENEPIG have been performed with various kinds of solders. Most of the studies were performed with Sn-3.0Ag-0.5Cu solder [ 16 , 17 , 18 , 19 , 20 , 21 , 22 , 23 , 24 ] and a small number of studies were performed with Sn-Ag [ 25 , 26 ] and Sn-Bi alloys [ 27 , 28 ]. Through these experiments, it was proven that the use of ENEPIG, instead of ENIG, reduced the consumption of the Ni-P layer and delayed the formation of the Ni 3 SN 4 /Ni-Sn-P microstructure, thereby preventing brittle fracture and improving the mechanical reliability.…”

Section: Introductionmentioning

confidence: 99%

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

2022

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Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite solders and duration of solid-state aging at 100 °C. At Sn-58Bi-xPt/ENIG interfaces, typical Ni3Sn4/Ni3P(P-rich layer) microstructure was formed. With the large consumption of the Ni-P layer, the Ni-P and Cu layers were intermixed and Cu atoms spread over the composite solder after 500 h of aging. By contrast, a (Pd,Ni)Sn4/thin Ni3Sn4 microstructure was observed at the Sn-58Bi-xPt/ENEPIG interfaces. The (Pd,Ni)Sn4 IMC effectively suppressed the consumption of the Ni-P layer and Ni3Sn4 growth, functioning as a good diffusion barrier. Therefore, the Sn-58Bi-xPt/ENEPIG joint survived 500 h of aging without microstructural degradation. Based on the experimental results and analysis of this study, Sn-58Bi-0.05Pt/ENEPIG is suggested as the optimum combination for future low-temperature soldering systems.

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“…During the soldering process, the intermetallic compound (IMC) can be formed at the solder/PCB finish interface, which is essential for mechanical, conductive and thermal properties. As for the ENIG finish, the electroless nickel layer acts as a diffusion barrier against Cu migration, and the immersion gold layer can prevent surface oxidation to improve weldability [14]. However, during the immersion gold plating process, ENIG corrodes the Ni (P) layer and causes cracks, which are called "black pad" phenomena [15,16].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

et al. 2022

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The 42 wt.% Sn–58 wt.% Bi (Sn-58Bi) Ball Grid Array (BGA) solder balls were mounted to electroless nickel-electroless palladium-immersion gold (ENEPIG) pads by employing the reflow process profile. The effects of reflow cycles and aging time on the interfacial microstructure and growth behavior of intermetallic compounds, as well as the mechanical properties, were investigated. Pd-Au-Sn intermetallic compound (IMC) was formed at the Sn-58Bi/ENEPIG interface. With the increase in reflow cycles and aging time, the IMC grew gradually. After five reflow cycles, the shear strength of the Sn-58Bi/ENEPIG solder joints first decreased and then increased. After 500 h of aging duration under −40 °C, the shear strength of the Sn-58Bi/ENEPIG solder joints decreased by about 12.3%. The fracture mode transferred from ductile fracture to ductile and brittle mixed fracture owing to the fact that the fracture location transferred from the solder matrix to the IMC interface with the increase in reflow cycles and aging time.

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Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system

Cited by 39 publications

References 28 publications

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

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