Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Abstract

The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Сверхпроводимость эвтектического сплава Bi-Sn

“…Сверхпроводящие сплавы также используются для спайки проводов и кабелей в тех случаях, когда материал должен обладать как характеристиками хорошего припоя, так и низким сопротивлением. По причине токсичности свинца ранее широко используемый в качестве припоя, сплав Sn−Pb во многих странах был ограничен в применении [2]. Поэтому в настоящее время ведутся активные исследования альтернативных сверхпроводящих сплавов.…”

“…Этим объясняется большое количество работ, посвященных сплавам олова [3][4][5][6][7][8][9]. Среди них выделяется сплав Bi−Sn [2,[10][11][12].…”

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead‐Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

“…As a result, the Sn-Ag-Cu (SAC) solder is developed as an alternative solder alloy. is solder alloy with different compositions has found wide acceptance in the industry owing to the amalgamation of good solder properties accompanied by reasonably decent mechanical properties [10][11][12].…”

Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

“…Traditionally in the electronic packaging industry, conventional Sn-Pb solder has been a dominant material due to its good properties and low cost [1]. However, with increased concerns relating to human health and the environment, legislation and regulations have been established to eliminate or limit the usage of lead due to the toxic nature of Pb, such as the restriction of certain hazardous substances (RoHS), and waste electrical equipment (WEEE) [2]. Thus, the pursuit of alternative lead-free soldering materials has become inevitable.…”