Properties enhancement of SnAgCu solders containing rare earth Yb

Zhang, Liang; Fan, Xinping; Guo, Yong-huan; He, Chengwen

doi:10.1016/j.matdes.2013.12.076

Cited by 46 publications

(18 citation statements)

References 19 publications

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“…Table 1 shows activation energies data from other works [14][15][16][17] Comparing the materials and experiments, the discrepancy among the activation energies is due to the differences in the solder materials, diffusion couple method, aging conditions (temperatures and times) and relative analytical method which were used. In addition, the rare earth Ce and Yb can also reduce the IMC thickness in lead-free solder joints [18,19]. Table 2 shows the mechanical test of solder joints after aging treatment at 150°C for different times.…”

Section: Resultsmentioning

confidence: 99%

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

Xue

Shen

et al. 2014

J Mater Sci: Mater Electron

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Growth kinetics of intermetallic compound layers (IMCs) formed between SnZnGa/SnZnGaNd solders for re-flow soldering and Cu substrate during aging was investigated at temperatures between 100 and 150°C. The Cu 5 Zn 8 IMCs could be found by reacting SnZnGa/SnZnGaNd solders on Cu substrate, and it was found that the addition of rare earth Nd can decrease the thickness of the IMCs of SnZn/Cu solder joints. The apparent activation energies of Cu 5 Zn 8 which were calculated as 48.76 kJ/mol (SnZnGa) and 56.99 kJ/mol (SnZnGaNd). The shear force of Sn9Zn0.5Ga0.08Nd solder joint after aging treatment was remarkably higher than those of Sn-9Zn and Sn9Zn0.5Ga solder joints. The results would provide support to the superiority of Sn9ZnGaNd solder which can be used in the electronic packaging instead of traditional SnPb solder.

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Section: Resultsmentioning

confidence: 99%

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

Xue

Shen

et al. 2014

J Mater Sci: Mater Electron

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“…Furthermore, (Tu et al, 2017) have reported that 0.15 wt% of Ce addition into SAC improved microstructure by reducing the thickness of the IMCs. (Zhang et al, 2014) have recommended that additions of 0.05 wt% of Ytterbium (Yb) in SAC improves the properties of SAC in electronic packaging and refines the microstructure by retarding the growth of IMCs during soldering. In another study by (Gao et al, 2010b), the incorporation of a small concentration of Praseodymium (Pr) in SAC has shown to produce extra PrSn 3 particles which restrict the IMCs growth because of the heterogeneous nucleation by lowering the reaction time of liquid solder with the substrate.…”

Section: Microstructurementioning

confidence: 99%

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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“…Shi et al [11] reported that when Er content was less than 0.25 wt%, the spreading area of SnAgCu increased as Er increase. The spreading area of SnAgCu solder given a 13.3 % increase after soldering when the content of Yb was 0.05 wt% [12]. The wettability of SnAgCu shows obvious relationship with additives, however, the atmospheres, fluxes and substrates can also influence the wettability of lead-free solders.…”

Section: Introductionmentioning

confidence: 99%

Wettability optimization analysis of lead-free solders with Taguchi method

Zhang

Sun

Han

et al. 2015

J Mater Sci: Mater Electron

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In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the wettability of the lead-free solder joints were examined and calculated. Moreover, the effect of rare earth Eu on the wetting of SnAgCu solder was investigated, the effect mechanism was analyzed too. The wettability optimal design in the lead-free solders system has the combination of the SnAgCu-0.04Eu solder, RMA flux, Au/Ni/Cu substrate, and vacuum atmosphere. Moreover, the flux is the most important factor among the control factors in the wettability system.

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Properties enhancement of SnAgCu solders containing rare earth Yb

Cited by 46 publications

References 19 publications

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

Investigation on the intermetallic compound layer growth of SnZnGa/SnZnGaNd solder joints

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Wettability optimization analysis of lead-free solders with Taguchi method

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