2020
DOI: 10.1063/5.0001805
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Properties of grooved Dayem bridge based YBa2Cu3O7−δ superconducting quantum interference devices and magnetometers

Abstract: The transport properties of a YBa 2 Cu 3 O 7−δ superconducting quantum interference device (SQUID) based on grooved Dayem bridge weak links are studied as a function of temperature: at high temperatures (60 K< T < T c = 89 K) the weak links show properties similar to SNS junctions, while at temperatures below 60 K the weak links behave like short Dayem bridges. Using these devices, we have fabricated SQUID magnetometers with galvanically coupled in-plane pick-up loops: at T = 77 K, magnetic field white noise l… Show more

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Cited by 22 publications
(6 citation statements)
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“…The typical structure of a YBCO cell (a very well studied material for its numerous fundamental applications [20,21]) is represented in Fig. 5, in which δ = 4.25Å is the thickness of our plasma sheet and d = 3.18Å is the distance between the layers.…”
Section: Numerical Resultsmentioning
confidence: 99%
“…The typical structure of a YBCO cell (a very well studied material for its numerous fundamental applications [20,21]) is represented in Fig. 5, in which δ = 4.25Å is the thickness of our plasma sheet and d = 3.18Å is the distance between the layers.…”
Section: Numerical Resultsmentioning
confidence: 99%
“…1). Single microstrips with width from 2 μm up to 5 μm with different length ranging from 5 μm up to 25 μm has been fabricated by using electron beam lithography (EBL) and lift off technique [22,23] (Fig. 1 right).…”
Section: Fabricationmentioning
confidence: 99%
“…Former items, indeed, represent key elements to determine the overall properties of innovative materials and for circumventing issues that do not allow the development of new solutions for various research fields. For example, single layer materials growth requires substrates having an atomically flat surface properly treated [ 11 , 12 ] as reported for the development of devices where the transport properties are heavily influenced by the used deposition techniques expected to be compatible with the entire nanofabrication protocol [ 13 , 14 , 15 , 16 ] or of electronic devices [ 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%