Properties of High Performance Alloys for Electromechanical Connectors

Kuhn, H.-A.; Altenberger, A. Käufler I.; Hölzl, H.; Fünfer, M.

doi:10.5772/35148

Cited by 20 publications

(12 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Today, preferred and standardized alloys such as C7025 or C7035 contain ~3% silicides. The traditional approach for the development of high strength copper alloys is focused on chemical variation of precipitation hardened alloys [4]. In addition, microstructural control, e.g., generation of very fine grained or even ultra fine grained copper alloys, opens the door for tailored copper alloys combining optimized precipitate-as well as grain-or subgrain structure.…”

Section: Introductionmentioning

confidence: 99%

Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

Altenberger

Kuhn

Gholami

et al. 2015

Metals

View full text Add to dashboard Cite

Abstract:There is an increasing demand in the industry for conductive high strength copper alloys. Traditionally, alloy systems capable of precipitation hardening have been the first choice for electromechanical connector materials. Recently, ultrafine-grained materials have gained enormous attention in the materials science community as well as in first industrial applications (see, for instance, proceedings of NANO SPD conferences). In this study the potential of precipitation hardened ultra-fine grained copper alloys is outlined and discussed. For this purpose, swaging or accumulative roll-bonding is applied to typical precipitation hardened high-strength copper alloys such as Corson alloys. A detailed description of the microstructure is given by means of EBSD, Electron Channeling Imaging (ECCI) methods and consequences for mechanical properties (tensile strength as well as fatigue) and electrical conductivity are discussed. Finally the role of precipitates for thermal stability is investigated and promising concepts (e.g. tailoring of stacking fault energy for grain size reduction) and alloy systems for the future are proposed and discussed. The relation between electrical conductivity and strength is reported.

show abstract

Section: Introductionmentioning

confidence: 99%

Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

Altenberger

Kuhn

Gholami

et al. 2015

Metals

View full text Add to dashboard Cite

show abstract

“…9). The obtained maximum values of mechanical stresses are of the same order as the short-term strength limit of electrical copper (200-250 MPa [20]) which decreases with increasing temperature.…”

Section: Mechanical State Of Stress and Strainmentioning

confidence: 53%

A Refined Mathematical Model of Physical Processes in a Conductor at a High-Current Pulse Discharge

Bajda

Pantelyat

2021

LEPE

View full text Add to dashboard Cite

A novel mathematical model describing physical processes during the flow of an aperiodic pulse current with amplitude of 100 kA along a conductor with a circular cross-section is proposed and investigated. It is shown how a short-term electric discharge of an aperiodic shape affects the distribution of the current density in the cross-section of the conductor, causing its nonuniform heating and the appearance of significant thermal forces as well as mechanical stresses and strains. Based on the developed mathematical model, the relation-ship between electromagnetic, thermal and mechanical phenomena is shown, allowing a deeper understanding of the multiphysics processes taking place. The maximum values of the current density are calculated, which on the surface of the conductor reach values of 47 kA/mm2, while the temperature rise of a copper conductor with a diameter of 2.44 mm is no more than 80ºC at high temperature gradients, which causes the appearance of thermal stresses that have value (40–50)% of the value of the short-term strength limit of electrical copper. Utilization of this model allows to more accurately determine the required conductor cross-section based on the characteristics of electromagnetic, thermal and mechanical pro-cesses. It is shown that the simplified model (the condition for the uniform distribution of the current over the cross-section) gives significantly underestimated values of temperatures and does not take into account temperature deformations.

show abstract

“…The addition of a small amount of Mg also increases the strength and the stress relaxation resistance by the effect of Mg-atom drag on the dislocation motion [46]. In addition, Mg atoms improve the stress relaxation resistance by solid solution hardening because of the large difference between the atomic radii of Mg and Cu [47,48]. Moreover, Mg also promotes the formation of silicides.…”

Section: Cu-ni-si Systemmentioning

confidence: 99%

High strength and high conductivity Cu alloys: A review

Yang

Lei

et al. 2020

Sci. China Technol. Sci.

View full text Add to dashboard Cite

High strength and high conductivity (HSHC) Cu alloys are widely used in many fields, such as high-speed electric railway contact wires and integrated circuit lead frames. Pure Cu is well known to have excellent electrical conductivity but rather low strength. The main concern of HSHC Cu alloys is how to strengthen the alloy efficiently. However, when the Cu alloys are strengthened by a certain method, their electrical conductivity will inevitably decrease to a certain extent. This review introduces the strengthening methods of HSHC Cu alloys. Then the research progress of some typical HSHC Cu alloys such as Cu-Cr-Zr, Cu-Ni-Si, Cu-Ag, Cu-Mg is reviewed according to different alloy systems. Finally, the development trend of HSHC Cu alloys is forecasted. It is pointed out that precipitation and micro-alloying are effective ways to improve the performance of HSHC Cu alloys. At the same time, the production of HSHC Cu alloys also needs to comply with the large-scale, low-cost development trend of industrialization in the future.

show abstract

Properties of High Performance Alloys for Electromechanical Connectors

Cited by 20 publications

References 17 publications

Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

Ultrafine-Grained Precipitation Hardened Copper Alloys by Swaging or Accumulative Roll Bonding

A Refined Mathematical Model of Physical Processes in a Conductor at a High-Current Pulse Discharge

High strength and high conductivity Cu alloys: A review

Contact Info

Product

Resources

About