“…First, since deposition of a defect-free thin film is challenging, especially across the relatively large area of some devices, the dielectric layer often experiences electric leakage or even breakdown 14 , resulting in the notorious device failure by electrolysis 24 . Second, this hydrophobic topcoat, for example, polytetrafluoroethylene (PTFE), is susceptible to dielectric charging 15,40 and prone to protein fouling 16 , not to mention its material and deposition costs. Despite the associated problems, the dielectric layer and hydrophobic topcoat (enabling EWOD) were the critical advances that made the once-obscure concept of electrowetting practical in applications, leading to the digital microfluidics of today.…”