2006
DOI: 10.1109/tns.2006.885006
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Proton and Heavy Ion Irradiation Effects on AlGaN/GaN HFET Devices

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Cited by 46 publications
(17 citation statements)
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“…Robustness value obtained is confirmed by several works reported in literature [9][10][11][12][13][14][15][16][17]. White et al [11] further provides fruitful discussion about displacement damage effects by means of Catodoluminescence and Secondary Ion Mass Spectrometry.…”
Section: Introductionsupporting
confidence: 71%
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“…Robustness value obtained is confirmed by several works reported in literature [9][10][11][12][13][14][15][16][17]. White et al [11] further provides fruitful discussion about displacement damage effects by means of Catodoluminescence and Secondary Ion Mass Spectrometry.…”
Section: Introductionsupporting
confidence: 71%
“…DC analysis confirms that InAlN/GaN structures demonstrate a robustness comparable to AlGaN/GaN [9][10][11][12][13][14][15][16][17] and AlN/GaN [22] devices. According to significant repeatability demonstrated, we will provide a preliminary example for a representative device.…”
Section: Characterizationmentioning
confidence: 70%
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“…The primary mechanism for degradation of DC and RF characteristics is displacement damage [3][4][5], which can mainly be observed at very high fluences and low proton energies, while high energy irradiation has typically less impact in GaN-HEMT performances [4]. The observed degradation tends to be proportional to the non ionising energy loss, and does not pose a serious risk for most of the typical orbits and shielding configurations, given the high fluences (>10 12 p/cm 2 ) required to observe significant changes in the device characteristics.…”
Section: Introductionmentioning
confidence: 99%