1983
DOI: 10.1109/tns.1983.4333080
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Radiation-Induced Interface States of Poly-Si Gate MOS Capacitors Using Low Temperature Gate Oxidation

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Cited by 81 publications
(27 citation statements)
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“…Previous measurements of the radiation-induced increase in Dit have reported a sublinear dose2/3 dependence [4,14]. Here, we find Dit to increase linearly with dose initially, followed by sublinear dependence at higher doses, implying that the dose2/3 dependence is a high dose effect as suggested by McLean [14].…”
Section: Introductionsupporting
confidence: 83%
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“…Previous measurements of the radiation-induced increase in Dit have reported a sublinear dose2/3 dependence [4,14]. Here, we find Dit to increase linearly with dose initially, followed by sublinear dependence at higher doses, implying that the dose2/3 dependence is a high dose effect as suggested by McLean [14].…”
Section: Introductionsupporting
confidence: 83%
“…The generation of fast interface states Dit at the Si-SiO2 interface by ionizing radiation [1][2][3][4][5][6] and by other processes [7][8][9] has been investigated extensively because of its importance in the degradation of MOS devices.…”
Section: Introductionmentioning
confidence: 99%
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“…The BOX capacitors were fabricated using commercial smart-cut Ò wafers, which had the top silicon layer over etched by 5% using Reactive Ion Etching (RIE) to reveal the 400 nm BOX. The thermal oxide capacitors were fabricated using a wet thermal oxide grown at a temperature of 850°C [12,13] for 9.5 h to achieve a target oxide thickness of 400 nm. From ellipsometer measurements, the wafer oxide thicknesses were 423 ± 10 nm and 390 ± 10 nm for the thermal oxide and BOX capacitors, respectively.…”
Section: Methodsmentioning
confidence: 99%
“…The effect of process and device parameters on the device performance has been the subject of many investigations [11][12][13]. The suitability and usability of MOS devices as a radiation sensor depends on the device sensitivity which is directly related to the gate insulator and its interface with the underlying semiconductor.…”
Section: Introductionmentioning
confidence: 99%